參數(shù)資料
型號(hào)： PC8641MSH1333JB
廠商： E2V TECHNOLOGIES PLC
元件分類： 微控制器/微處理器
英文描述： MICROPROCESSOR, CBGA1023
封裝： 33 X 33 MM, 2.72 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, CERAMIC, FC-BGA-1023
文件頁(yè)數(shù)： 109/111頁(yè)
文件大?。?/td> 1660K
代理商： PC8641MSH1333JB
97
0893C–HIREL–01/10
e2v semiconductors SAS 2010
PC8641 and PC8641D [Preliminary]
Figure 21-3. SerDes PLL Power Supply Filter
Note:
1. An 0805 sized capacitor is recommended for system initial bring-up.
Note the following:
AV
DD should be a filtered version of SVDD.
Signals on the SerDes interface are fed from the SV
DD power plan.
21.2.2
PLL Power Supply Sequencing
For details on power sequencing for the AV
DD type and supplies refer to Section 3.2 ”Power Up/Down
21.3
Decoupling Recommendations
Due to large address and data buses, and high operating frequencies, the device can generate transient
power surges and high frequency noise in its power supply, especially while driving large capacitive
loads.
This noise must be prevented from reaching other components in the PC8641 system, and the device
itself requires a clean, tightly regulated source of power. Therefore, it is recommended that the system
designer place at least one decoupling capacitor at each OV
DD, Dn_GVDD, LVDD, TVDD, VDD_Coren, and
V
DD_PLAT pin of the device. These decoupling capacitors should receive their power from separate
OV
DD, Dn_GVDD, LVDD, TVDD, VDD_Coren, and VDD_PLAT and GND power planes in the PCB, utilizing
short traces to minimize inductance. Capacitors may be placed directly under the device using a stan-
dard escape pattern. Others may surround the part.
These capacitors should have a value of 0.01 or 0.1 F. Only ceramic SMT (surface mount technology)
capacitors should be used to minimize lead inductance, preferably 0402 or 0603 sizes.
In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB,
feeding the OV
DD, Dn_GVDD, LVDD, TVDD, VDD_Coren, and VDD_PLAT planes, to enable quick recharg-
ing of the smaller chip capacitors. They should also be connected to the power and ground planes
through two vias to minimize inductance. Suggested bulk capacitors—100–330 F (AVX TPS tantalum
or Sanyo OSCON).
1.0 F
(1)
0.003 F
GND
1.0
AVDD_SRDSn
n = 1, 2
SVDD
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