參數(shù)資料
型號(hào)： PC8641MSH1333JB
廠商： E2V TECHNOLOGIES PLC
元件分類： 微控制器/微處理器
英文描述： MICROPROCESSOR, CBGA1023
封裝： 33 X 33 MM, 2.72 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, CERAMIC, FC-BGA-1023
文件頁數(shù)： 102/111頁
文件大小： 1660K
代理商： PC8641MSH1333JB
90
0893C–HIREL–01/10
PC8641 and PC8641D [Preliminary]
e2v semiconductors SAS 2010
20.2
Thermal Management Information
This section provides thermal management information for the high coefficient of thermal expansion
(HiTCE) package for air-cooled applications. Proper thermal control design is primarily dependent on the
system-level design: the heat sink, airflow, and thermal interface material. The PC8641 implements sev-
eral features designed to assist with thermal management, including the temperature diode. The
temperature diode allows an external device to monitor the die temperature in order to detect excessive
temperature conditions and alert the system; see Section 20.2.4 ”Temperature Diode” on page 94, for
more information.
To reduce the die-junction temperature, heat sinks are required; due to the potential large mass of the
heat sink, attachment through the printed-circuit board is suggested. In any implementation of a heat
sink solution, the force on the die should not exceed ten pounds force (45 newtons). Figure 20-1 and Fig-
ure 20-2 on page 91 show a spring clip through the board. Occasionally the spring clip is attached to
soldered hooks or to a plastic backing structure. Screw and spring arrangements are also frequently
used.
Figure 20-1. FC-CBGA Package Exploded Cross-Sectional View with Several Heat Sink Options
A clip-on-chip heat sink solution will NOT work with the FC-CLGA part.
A through-hole solution is recommended, as shown in Figure 20-2 on page 91 below.
HCTE FC-CBGA Package
Heat Sink
Heat Sink Clip
Thermal Interface Material
Printed-Circuit Board
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