- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄299624 > PC8641MSH1333JB (E2V TECHNOLOGIES PLC) MICROPROCESSOR, CBGA1023 PDF資料下載
參數(shù)資料
| 型號： | PC8641MSH1333JB |
| 廠商： | E2V TECHNOLOGIES PLC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | MICROPROCESSOR, CBGA1023 |
| 封裝： | 33 X 33 MM, 2.72 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, CERAMIC, FC-BGA-1023 |
| 文件頁數(shù)： | 103/111頁 |
| 文件大小： | 1660K |
| 代理商： | PC8641MSH1333JB |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁第100頁第101頁第102頁當(dāng)前第103頁第104頁第105頁第106頁第107頁第108頁第109頁第110頁第111頁
91
0893C–HIREL–01/10
e2v semiconductors SAS 2010
PC8641 and PC8641D [Preliminary]
Figure 20-2. FC-CLGA Package Exploded Cross-Sectional View with Several Heat Sink Options
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal per-
formance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
20.2.1
Internal Package Conduction Resistance
For the exposed-die packaging technology described in Table 20-1 on page 89, the intrinsic conduction
thermal resistance paths are as follows:
The die junction-to-case thermal resistance (the case is actually the top of the exposed silicon die)
The die junction-to-board thermal resistance
Figure 20-3 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Figure 20-3. Package with Heat Sink Mounted to a Printed-Circuit Board
Heat generated on the active side of the chip is conducted through the silicon, through the heat sink
attach material (or thermal interface material), and finally to the heat sink where it is removed by forced-
air convection.
Because the silicon thermal resistance is quite small, the temperature drop in the silicon may be
neglected for a first-order analysis. Thus the thermal interface material and the heat sink conduction/con-
vective thermal resistances are the dominant terms.
HCTE FC-CLGA Package
Heat Sink Clip
Heat Sink
Thermal Interface Material
Printed-Circuit Board
External Resistance
Internal Resistance
Radiation
Convection
Heat Sink
Thermal Interface Material
Die/Package
Die Junction
Package/Leads
Printed-Circuit Board
Radiation
Convection
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| PCA9534APWRG4 | 8 I/O, PIA-GENERAL PURPOSE, PDSO16 |
| PCA9534APWR | 8 I/O, PIA-GENERAL PURPOSE, PDSO16 |
| PCA9554ADBRG4 | 8 I/O, PIA-GENERAL PURPOSE, PDSO16 |
| PCB1A24S | 24 CONTACT(S), FEMALE, STRAIGHT SINGLE PART CARD EDGE CONN, SCREW |
| PCD25F98S0T20 | 25 CONTACT(S), FEMALE, D SUBMINIATURE CONNECTOR, PRESS FIT |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PC8641VGH1333JE | 制造商:e2v technologies 功能描述:PC8641VGH1333JE - Trays |
| PC8641VU1000GB | 制造商:Freescale Semiconductor 功能描述:MPU RISC 32BIT CMOS 1GHZ 1.05V/1.8V/2.5V/3.3V 994FCCBGA - Bulk |
| PC8641VU1000GC | 制造商:Freescale Semiconductor 功能描述:MPU RISC 32BIT CMOS 1GHZ 1.05V/1.8V/2.5V/3.3V 994FCCBGA - Bulk |
| PC8641VU1000NB | 制造商:Freescale Semiconductor 功能描述:MPU RISC 32BIT CMOS 1GHZ 1.05V/1.8V/2.5V/3.3V 994FCCBGA - Bulk |
| PC8641VU1000NC | 制造商:Freescale Semiconductor 功能描述:MPU RISC 32BIT CMOS 1GHZ 1.05V/1.8V/2.5V/3.3V 994FCCBGA - Bulk |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。