參數(shù)資料
型號(hào)： PC8641MSH1333JB
廠商： E2V TECHNOLOGIES PLC
元件分類： 微控制器/微處理器
英文描述： MICROPROCESSOR, CBGA1023
封裝： 33 X 33 MM, 2.72 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, CERAMIC, FC-BGA-1023
文件頁(yè)數(shù)： 100/111頁(yè)
文件大?。?/td> 1660K
代理商： PC8641MSH1333JB
89
0893C–HIREL–01/10
e2v semiconductors SAS 2010
PC8641 and PC8641D [Preliminary]
19.4.2
Platform to FIFO restrictions
Please note the following FIFO maximum speed restrictions based on platform speed.
For FIFO GMII mode:
FIFO TX/RX clock frequency <= platform clock frequency / 4.2
For example, if the platform frequency is 533MHz, the FIFO TX/RX clock frequency should be no more
than 127 MHz
For FIFO encoded mode:
FIFO TX/RX clock frequency <= platform clock frequency / 3.2
For example, if the platform frequency is 533 MHz, the FIFO TX/RX clock frequency should be no more
than 167 MHz
20. Thermal
This section describes the thermal specifications of the PC8641.
20.1
Thermal Characteristics
Table 20-1 provides the package thermal characteristics for the PC8641.
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance,
mounting site (board) temperature, ambient temperature, air flow, power dissipation of other compo-
nents on the board, and board thermal resistance.
2. Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
3. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temper-
ature is measured on the top surface of the board near the package.
5. This is the thermal resistance between die and case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the calculated case temperature. Actual thermal resistance is less
than 0.1
° C/W.
Note:
The thermal performance of the LGA and the BGA versions of the package are the same. For the thermal
model, the only difference is the height of the solder layer under the substrate.
Table 20-1.
Package Thermal Characteristics
Characteristic
Symbol
Value
Unit
Notes
Junction-to-ambient thermal resistance, natural convection,
single-layer (1s) board
RΘJA
18
° C/W
Junction-to-ambient thermal resistance, natural convection,
four-layer (2s2p) board
RΘJA
13
° C/W
Junction-to-ambient thermal resistance, 200 ft/min airflow,
single-layer (1s) board
RΘJMA
13
° C/W
Junction-to-ambient thermal resistance, 200 ft/min airflow,
four-layer (2s2p) board
RΘJMA
9
° C/W
Junction-to-board thermal resistance
RΘJB
5
° C/W
Junction-to-case thermal resistance
RΘJC
< 0.1
° C/W
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