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5.2 Recommended Operating Conditions
TMS320DM647/TMS320DM648
Digital Media Processor
SPRS372–MAY 2007
MIN
NOM
MAX
UNIT
C
VDD
Supply voltage, Core
(1)
C
VDDESS
Supply voltage, Ethernet Subsystem Core
(1)
C
VDD1
Supply voltage, DDR Core
(1)
(-720, -900
devices)
1.14
1.2
1.26
V
A
VDDA
Supply voltage, SerDes Analog
(1)
D
VDDD
Supply voltage, SerDes Digital
(1)
A
VDDT
Supply voltage, SerDes Analog
(1)
D
VDD33
Supply voltage, I/O, 3.3 V
3.14
3.3
3.46
V
D
VDD18
Supply voltage, DDR I/O, 1.8 V
A
VDLL1
Supply voltage, I/O, 1.8 V
1.71
1.8
1.89
V
A
VDLL2
Supply voltage, I/O, 1.8 V
A
VDDR
Supply voltage, 1.8-V SerDes Analog Supply (Regulator)
V
SS
Supply ground (V
SS
)
0
0
0
V
V
REFSSTL
DDR2 reference voltage
(2)
0.49D
VDD18
0.5D
VDD18
0.51D
VDD18
V
High-level input voltage, 3.3 V(except I2C pins)
2
V
V
IH
High-level input voltage, I2C
0.7D
VDD33
Low-level input voltage, 3.3 V(except I2C pins)
0.8
V
V
IL
Low-level input voltage, I2C
0
0.3DV
DD33
V
T
J
Operating Junction temperature
(3)
Commercial
0
90
°
C
(-900 devices)
33.3
900
MHz
F
SYSCLK1
DSP Operating Frequency (SYSCLK1)
(-720 devices)
33.3
720
MHz
(1)
Future variants of TI SOC devices may operate at voltages ranging from 0.9 V to 1.4 V to provide a range of system power/performance
options. TI highly recommends that users design-in a supply that can handle multiple voltages within this range (i.e., 1.0 V, 1.05 V,
1.1 V, 1.14 V, 1.2, 1.26 V with
±
3% tolerances) by implementing simple board changes such as reference resistor values or input pin
configuration modifications. Not incorporating a flexible supply may limit the system ability to easily adapt to future versions of TI SOC
devices.
V
is expected to equal 0.5DV
of the transmitting device and to track variations in the D
.
In the absence of a heat sink, use the following formula to determine the device junction temperature: T
J
= T
C
+ (Power x Psi
JT
). Power
and T
C
can be measured by the user.
(2)
(3)
Device Operating Conditions
54
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