參數(shù)資料
型號: TMX320DM647ZUT720
廠商: Texas Instruments, Inc.
英文描述: Digital Media Processor
中文描述: 數(shù)字媒體處理器
文件頁數(shù): 165/166頁
文件大?。?/td> 1341K
代理商: TMX320DM647ZUT720
www.ti.com
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7
Mechanical Data
7.1 Thermal Data for ZUT
7.1.1 Packaging Information
TMS320DM647/TMS320DM648
Digital Media Processor
SPRS372–MAY 2007
The following table(s) show the thermal resistance characteristics for the ZUT mechanical package.
See Power Application Report.
Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZUT]
NO.
1
2
3
4
5
7
8
9
11
12
13
°
C/W
(1)
AIR FLOW (m/s)
(2)
R
Θ
JC
R
Θ
JB
Junction-to-case
Junction-to-board
R
Θ
JA
Junction-to-free air
Psi
JT
Junction-to-package top
Psi
JB
Junction-to-board
(1)
The junction-to-case measurement was conducted in a JEDEC defined 1S0P system. Other measurements were conducted in a JEDEC
defined 1S2P system and will change based on environment as well as application.
For more information, see these three EIA/JEDEC standards:
EIA/JESD51-2,
Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
EIA/JESD51-3,
Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-7,
High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
.
m/s = meters per second
(2)
The following packaging information and addendum reflect the most current data available for the
designated device(s). This data is subject to change without notice and without revision of this document.
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Mechanical Data
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