
Device Characteristics
22
April 2003 Revised June 2004
SPRS219D
1.4
Device Characteristics
Table 11 provides an overview of the C6412 DSP. The table shows significant features of the C6412 device,
including the capacity of on-chip RAM, the peripherals, the CPU frequency, and the package type with pin
count.
Table 11. Characteristics of the C6412 Processor
HARDWARE FEATURES
EMIFA (64-bit bus width)
(clock source = AECLKIN)
C6412
1
EDMA (64 independent channels)
1
I2C0 (uses Peripheral Clock)
1
Peripherals
HPI (32- or 16-bit user selectable)
1 (HPI16 or HPI32)
Not all peripherals pins are
available at the same time
(For more detail, see the
Device Configuration
section).
PCI (32-bit), 66-MHz/33-MHz
[DeviceID Register value 0x9065]
1
McBSPs
(internal clock source = CPU/4 clock frequency)
2
10/100 Ethernet MAC (EMAC)
1
Management Data Input/Output (MDIO)
1
32-Bit Timers
(internal clock source = CPU/8 clock frequency)
3
General-Purpose Input/Output Port (GP0)
16
Size (Bytes)
288K
On-Chip Memory
Organization
16K-Byte (16KB) L1 Program (L1P) Cache
16KB L1 Data (L1D) Cache
256KB Unified Mapped RAM/Cache (L2)
CPU ID + CPU Rev ID
Control Status Register (CSR.[31:16])
0x0C01
JTAG BSDL_ID
JTAGID register (address location: 0x01B3F008)
0x0007902F
Frequency
MHz
500, 600
Cycle Time
ns
2 ns (C6412-500) and (C6412
A
-500)
[500 MHz CPU, 100 MHz EMIF, 33 MHz PCI port]
1.67 ns (C6412-600)
[600 MHz CPU, 133 MHz EMIF, 66 MHz PCI port]
1.2 V (-500)
1.4 V (
A
-500, -600)
Voltage
Core (V)
I/O (V)
3.3 V
PLL Options
CLKIN frequency multiplier
Bypass (x1), x6, x12
BGA Package
23 x 23 mm
548-Pin BGA (GDK)
27 x 27 mm
μ
m
Product Preview (PP), Advance Information (AI),
or Production Data (PD)
548-Pin BGA (GNZ)
0.13
μ
m
Process Technology
Product Status
PD
Device Part Numbers
(For more details on the C6000
DSP part
numbering, see Figure 27)
TMS320C6412GDK500, TMS320C6412GNZ500,
TMS320C6412GDKA500, TMS320C6412GNZA500,
TMS320C6412GDK600, TMS320C6412GNZ600
On this C64x
device, the rated EMIF speed affects only the SDRAM interface on the EMIF. For more detailed information, see the EMIF device
speed portion of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard
warranty. Production processing does not necessarily include testing of all parameters.