參數(shù)資料
型號： PCL6045B
廠商： Electronic Theatre Controls, Inc.
英文描述： User Manual For PCL6045B Pulse Control LSI
中文描述： 用戶手冊PCL6045B脈沖控制大規(guī)模集成電路
文件頁數(shù)： 174/176頁
文件大小： 7952K
代理商： PCL6045B
-
167
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6)
When
using
an
infrared
reflow
system
to
apply
solder,
we
recommend
the
use
of
a
far-infrared
pre-heater
and
mid-infrared
reflow
devices,
in
order
to
ease
the
thermal
stress
on
the
LSIs.
Package
and
substrate
surface
temperatures
must
never
exceed
240
o
C
and
they
must
not
exceed
210
o
C
for
more
than
30
seconds.
The
temperature
change
when
cooling
after
a
solder
reflow
process
must
be
less
than
3
o
C
per
second.
7)
When
using
hot
air
for
solder
reflow,
the
restrictions
are
the
same
as
for
infrared
reflow
equipment.
8)
When
using
vapor
phase
solder,
use
Fluorinate
FC-70
solvent,
or
its
equivalent.
The
ambient
temperature
must
not
exceed
215
o
C
for
more
than
30
seconds
and
it
must
not
exceed
200
o
C
for
more
than
60
seconds.
9)
When
using
a
solder
iron,
the
lead
section
temperature
must
not
exceed
260
o
C
for
more
than
10
seconds
or
350
o
C
for
more
than
3
seconds.
Product
flow
direction
Mid-infrared
heater
(reflow-heater)
Far-infrared
heater
(pre-heater)
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