參數(shù)資料
型號： OMAP5910(DSP)
英文描述： Dual-Core Processor
中文描述： 雙核處理器
文件頁數(shù)： 19/160頁
文件大?。?/td> 1997K
代理商： OMAP5910(DSP)
Introduction
7
August 2002 Revised August 2003
SPRS197B
Table 21. GZG BGA Terminal Assignments (Continued)
GZG
BGA
BALL #
MCSI2.DIN/
USB2.VP
MPU_BOOT/
MCBSP3.DR/
USB1.SUSP
GZG
BGA
BALL #
SIGNAL
GZG
BGA
BALL #
SIGNAL
GZG
BGA
BALL #
SIGNAL
SIGNAL
AA7
VSS
AA9
AA11
DVDD1
AA13
MCSI1.CLK/
USB1.VM
AA15
UART1.RTS
AA17
AA19
TDO
AA20
CLK32K_CTRL
AA21
VSS
Figure 22 illustrates the ball locations for the 289-ball GDY ball grid array (BGA) package and is used in
conjunction with Table 21 to locate signal names and ball grid numbers. GDY BGA ball numbers in
Figure 22 are read from left-to-right, top-to-bottom.
A
1
2
B
4
3
6
5
8
7
10
9
12
11
14
13
16
15
17
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
Bottom View
NOTE: The GDY package has not been released to production and is still in product preview phase.
Figure 22. OMAP5910 GDY Package (Bottom View)
In Table 22, signals with multiplexed functions are highlighted in gray. Signals within a multiplexed pin name
are separated with forward slashes as follows:
signal1/signal2/signal3
(for example, GPIO11/HDQ)
Signals which are associated with specific peripherals are denoted by using the peripheral name, followed
by a period, and then the signal name; as follows:
peripheral1.signal1
(for example, MCBSP1.DR)
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相關代理商/技術參數(shù)
參數(shù)描述
OMAP5910GGZG1 制造商:Rochester Electronics LLC 功能描述:- Bulk
OMAP5910GGZG2 制造商:Rochester Electronics LLC 功能描述:- Bulk
OMAP5910JGDY1R 功能描述:IC OMAP DUAL-CORE PROC 289-BGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:OMAP-59xx 標準包裝:60 系列:SCC 處理器類型:Z380 特點:全靜電 Z380 CPU 速度:20MHz 電壓:5V 安裝類型:表面貼裝 封裝/外殼:144-LQFP 供應商設備封裝:144-LQFP 包裝:托盤
OMAP5910JGDY2 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC Applications Proc RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
OMAP5910JGZG1 制造商:Texas Instruments 功能描述:
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