參數(shù)資料
型號： OMAP5910(DSP)
英文描述： Dual-Core Processor
中文描述： 雙核處理器
文件頁數(shù)： 119/160頁
文件大?。?/td> 1997K
代理商： OMAP5910(DSP)
Electrical Specifications
107
August 2002 Revised August 2003
SPRS197B
Tester Pin
Electronics
VLoad
IOL-test
C
T
IOH-test
Output
Under
Test
50
Where:
IOL-test
=
IOH-test
=
VLoad
=
CT
5 mA (all outputs)
300
μ
A (all outputs)
5 V
10 pF maximum and 5 pF minimum for EMIFF (50 pF maximum and 5 pF minimum for EMIFS and all other I/O pads).
=
Figure 51. 3.3-V Test Load Circuit
5.4
Package Thermal Resistance Characteristics
Table 51 provides the thermal resistance characteristics for the recommended package types used on the
OMAP5910 device.
Table 51. Thermal Resistance Characteristics
R
Θ
JA (
°
C/W)
34.01
R
Θ
JC (
°
C/W)
7.43
BOARD TYPE
High-K
63.26
7.13
Low-K
Board types are as defined by JEDEC. Reference JEDEC Standard JESD519,
Test Boards for Area Array Surface Mount Package Thermal Measurements.
5.5
Timing Parameter Symbology
Timing parameter symbols used in the timing requirements and switching characteristics tables are created
in accordance with JEDEC Standard 100. To shorten the symbols, some of the pin names and other related
terminology have been abbreviated as follows:
Lowercase subscripts and their meanings:
a
access time
c
cycle time (period)
d
delay time
dis
disable time
en
enable time
f
fall time
h
hold time
r
rise time
su
setup time
t
transition time
v
valid time
w
pulse duration (width)
X
Unknown, changing, or don’t care level
Letters and symbols and their meanings:
H
High
L
Low
V
Valid
Z
High impedance
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