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參數(shù)資料
| 型號： | OMAP5910(DSP) |
| 英文描述： | Dual-Core Processor |
| 中文描述： | 雙核處理器 |
| 文件頁數(shù)： | 14/160頁 |
| 文件大?。?/td> | 1997K |
| 代理商： | OMAP5910(DSP) |
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Introduction
2
August 2002 Revised August 2003
SPRS197B
2
Introduction
This section describes the main features of the OMAP5910 device, lists the terminal assignments, and
describes the function of each terminal. This data manual also provides a detailed description section,
electrical specifications, parameter measurement information, and mechanical data about the available
packaging.
2.1
Description
The OMAP5910 is a highly integrated hardware and software platform, designed to meet the application
processing needs of next-generation embedded devices.
The OMAP
platform enables OEMs and ODMs to quickly bring to market devices featuring rich user
interfaces, high processing performance, and long battery life through the maximum flexibility of a fully
integrated mixed processor solution.
The dual-core architecture provides benefits of both DSP and RISC technologies, incorporating a
TMS320C55x DSP core and a high-performance TI925T ARM core.
The OMAP5910 device is designed to run leading open and embedded RISC-based operating systems, as
well as the Texas Instruments (TI) DSP/BIOS
software kernel foundation, and is available in a 289-ball
MicroStar BGA package.
The OMAP5910 is targeted at the following applications:
Applications processing devices
Mobile communications
802.11
Bluetooth
wireless technology
GSM (including GPRS and EDGE)
CDMA
Proprietary government and other
Video and image processing (MPEG4, JPEG, Windows
Media Video, etc.)
Advanced speech applications (text-to-speech, speech recognition)
Audio processing (MPEG-1 Audio Layer3 [MP3], AMR, WMA, AAC, and other GSM speech codecs)
Graphics and video acceleration
Generalized web access
Data processing (fax, encryption/decryption, authentication, signature verification and watermarking)
2.1.1 TMS320C55x DSP Core
The DSP core of the OMAP5910 device is based on the TMS320C55x DSP generation CPU processor core.
The C55xDSP architecture achieves high performance and low power through increased parallelism and total
focus on reduction in power dissipation. The CPU supports an internal bus structure composed of one program
bus, three data read buses, two data write buses, and additional buses dedicated to peripheral and DMA
activity. These buses provide the ability to perform up to three data reads and two data writes in a single cycle.
In parallel, the DMA controller can perform up to two data transfers per cycle independent of the CPU activity.
OMAP and DSP/BIOS are trademarks of Texas Instruments.
Bluetooth is a trademark owned by Bluetooth SIG, Inc.
Windows is a registered trademark of Microsoft Corporation.
Other trademarks are the property of their respective owners.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| OMAP5910GGZG1 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| OMAP5910GGZG2 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| OMAP5910JGDY1R | 功能描述:IC OMAP DUAL-CORE PROC 289-BGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:OMAP-59xx 標(biāo)準(zhǔn)包裝:60 系列:SCC 處理器類型:Z380 特點:全靜電 Z380 CPU 速度:20MHz 電壓:5V 安裝類型:表面貼裝 封裝/外殼:144-LQFP 供應(yīng)商設(shè)備封裝:144-LQFP 包裝:托盤 |
| OMAP5910JGDY2 | 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC Applications Proc RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT |
| OMAP5910JGZG1 | 制造商:Texas Instruments 功能描述: |
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