
Data Sheet
ADuC7039
Rev. D | Page 9 of 92
ABSOLUTE MAXIMUM RATINGS
TA = 40°C to +115°C, unless otherwise noted.
Table 2.
Parameter
Rating
AGND to DGND to VSS to IO_VSS
0.3 V to +0.3 V
VBAT to AGND
22 V to +40 V
VDD to VSS
0.3 V to +40 V
LIN to IO_VSS
16 V to +40 V
LIN Short-Circuit Curren
t1200 mA
Digital I/O Voltage to DGND
0.3 V to REG_DVDD + 0.3 V
ADC Inputs to AGND
0.3 V to REG_AVDD + 0.3 V
ESD (HBM) Rating
HBM-ADI0082 (Based on
ANSI/ESD STM5.1-2007); All Pins
Except LIN and VBAT
2.5 kV
LIN and VBAT
±6 kV
IEC61000-4-2 for LIN and VBAT
±7 kV
Storage Temperature
150°C
Junction Temperature
Transient
150°C
Continuous
130°C
Lead Temperature
Soldering Reflow (15 sec)
260°C
1 200 mA can be sustained on the LIN pin for 2 seconds. The active internal
short circuit protection HVCFG[1] = 0 is required to be enabled on this
device during LIN operation and is the default operation. This disconnects
the LIN pin, if a short circuit event occurs, after the specified maximum
period of 90 μs.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION