參數(shù)資料
型號: OR4E02-2BM680I
英文描述: FPGA
中文描述: FPGA的
文件頁數(shù): 145/153頁
文件大小: 2737K
代理商: OR4E02-2BM680I
Lattice Semiconductor
145
Data Sheet
November, 2002
ORCA
Series 4 FPGAs
Package Parasitics
The
electrical
performance
of
an
IC
package,
such
as
signal
quality
and
noise
sensitivity,
is
directly
affected
by
the
package
parasitics.
Table
72
lists
eight
parasitics
associated
with
the
ORCA
packages.
These
parasitics
represent
the
contributions
of
all
components
of
a
package,
which
include
the
bond
wires,
all
internal
package
routing,
and
the
external
leads.
Four
inductances
in
nH
are
listed:
L
SW
and
L
SL,
the
self-inductance
of
the
lead;
and
L
MW
and
L
ML
,
the
mutual
induc-
tance
to
the
nearest
neighbor
lead.
These
parameters
are
important
in
determining
ground
bounce
noise
and
inductive
crosstalk
noise.
Three
capacitances
in
pF
are
listed:
C
M
,
the
mutual
capacitance
of
the
lead
to
the
nearest
neighbor
lead;
and
C
1
and
C
2
,
the
total
capacitance
of
the
lead
to
all
other
leads
(all
other
leads
are
assumed
to
be
grounded).
These
parameters
are
important
in
determining
capacitive
crosstalk
and
the
capacitive
loading
effect
of
the
lead.
Resistance
values
are
in
m
.
The
parasitic
values
in
Table
72
are
for
the
circuit
model
of
bond
wire
and
package
lead
parasitics.
If
the
mutual
capacitance
value
is
not
used
in
the
designer’s
model,
then
the
value
listed
as
mutual
capacitance
should
be
added
to
each
of
the
C
1
and
C
2
capacitors.
Table
72.
ORCA
Series
4
Package
Parasitics
5-3862(C)r2
Figure
60.
Package
Parasitics
Package
Type
352-Pin
PBGA
416-Pin
PBGAM
680-Pin
PBGAM
L
SW
5.00
3.52
3.80
L
MW
2.00
0.80
1.30
R
W
220
235
250
C
1
1.50
0.40
0.50
C
2
1.50
1.00
1.00
C
M
1.50
0.25
0.30
L
SL
7—12
1.5—5.0
2.8—5
L
ML
3—6
0.5—1.3
0.5—1.5
PAD N
L
SW
R
W
CIRCUIT
BOARD PAD
C
M
C
1
L
SW
R
W
L
SL
L
MW
C
2
C
1
L
ML
C
2
L
SL
PAD N + 1
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