參數(shù)資料
型號: OR4E02-2BM680I
英文描述: FPGA
中文描述: FPGA的
文件頁數(shù): 143/153頁
文件大?。?/td> 2737K
代理商: OR4E02-2BM680I
Lattice Semiconductor
143
Data Sheet
November, 2002
ORCA
Series 4 FPGAs
Θ
JC
This
is
the
thermal
resistance
from
junction
to
case.
It
is
most
often
used
when
attaching
a
heat
sink
to
the
top
of
the
package.
It
is
defined
by:
The
parameters
in
this
equation
have
been
defined
above.
However,
the
measurements
are
performed
with
the
case
of
the
part
pressed
against
a
water-cooled
heat
sink
to
draw
most
of
the
heat
generated
by
the
chip
out
the
top
of
the
package.
It
is
this
difference
in
the
measurement
process
that
differentiates
Θ
JC
from
ψ
JC.
Θ
JC
is
a
true
thermal
resistance
and
is
expressed
in
units
of
°C/W.
Θ
JB
This
is
the
thermal
resistance
from
junction
to
board
(
Θ
JL
).
It
is
defined
by:
where
T
B
is
the
temperature
of
the
board
adjacent
to
a
lead
measured
with
a
thermocouple.
The
other
parameters
on
the
right-hand
side
have
been
defined
above.
This
is
considered
a
true
thermal
resistance,
and
the
measure-
ment
is
made
with
a
water-cooled
heat
sink
pressed
against
the
board
to
draw
most
of
the
heat
out
of
the
leads.
Note
that
Θ
JB
is
expressed
in
units
of
°C/W,
and
that
this
parameter
and
the
way
it
is
measured
are
still
in
JEDEC
committee.
Θ
JC
T
J
--------------------
T
C
Q
=
Θ
JB
T
-------------------
T
B
Q
=
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