參數(shù)資料
型號(hào): OR3L225B
廠商: Lineage Power
英文描述: Field-Programmable Gate Arrays(現(xiàn)場(chǎng)可編程門陣列)
中文描述: 現(xiàn)場(chǎng)可編程門陣列(現(xiàn)場(chǎng)可編程門陣列)
文件頁(yè)數(shù): 15/88頁(yè)
文件大小: 2015K
代理商: OR3L225B
Lucent Technologies Inc.
15
Data Addendum
December 1999
ORCA OR3LxxxB Series FPGAs
Timing Characteristics
(continued)
Table 7. Ripple Mode PFU Timing Characteristics
OR3LxxB Commercial: V
DD
= 3.0 V to 3.6 V, V
DD
2 = 2.38 V to 2.63 V, 0 °C
<
T
A
<
70 °C; Industrial: V
DD
= 3.0 V
to 3.6 V, V
DD
2 = 2.38 V to 2.63 V, –40 °C
<
T
A
<
+85 °C.
Symbol
Parameter
(T
J
= +85 °C, V
DD
= min, V
DD
2 = min)
-7
-8
Unit
Min
Max
Min
Max
RIP_SET
FRIP_SET
FCIN_SET
CIN_SET
AS_SET
RIPRC_SET
FCINRC_SET
CINRC_SET
ASRC_SET
Full Ripple Setup Times (byte-wide):
Operands to Clock (Kz[1:0] to CLK)
Bitwise Operands to Clock (Kz[1:0] to CLK at F[z])
Fast Carry-in to Clock (FCIN to CLK)
Carry-in to Clock (CIN to CLK)
Add/Subtract to Clock (ASWE to CLK)
Operands to Clock (Kz[1:0] to CLK at REGCOUT)
Fast Carry-in to Clock (FCIN to CLK at REGCOUT)
Carry-in to Clock (CIN to CLK at REGCOUT)
Add/Subtract to Clock (ASWE to CLK at REGCOUT)
Full Ripple Hold Times (T
J
= all, V
DD
= all):
Fast Carry-in from Clock (FCIN from CLK at REG-
COUT)
All Others
Half Ripple Setup Times (nibble wide):
Operands to Clock (Kz[1:0] to CLK)
Bitwise Operands to Clock (Kz[1:0] to CLK at F[z])
Fast Carry-in to Clock (FCIN to CLK)
Carry-in to Clock (CIN to CLK)
Add/Subtract to Clock (ASWE to CLK)
Operands to Clock (Kz[1:0] to CLK at REGCOUT)
Fast Carry-in to Clock (FCIN to CLK at REGCOUT)
Carry-in to Clock (CIN to CLK at REGCOUT)
Add/Subtract to Clock (ASWE to CLK at REGCOUT)
Half Ripple Hold Times (T
J
= all, V
DD
= all):
Fast Carry-in from Clock (HFCIN from CLK at RE-
COUT)
All Others
1.58
0.90
1.21
1.68
4.70
1.02
1.03
1.48
4.51
1.37
0.78
1.05
1.46
4.09
0.89
0.90
1.29
3.92
ns
ns
ns
ns
ns
ns
ns
ns
ns
FCINRC_HLD
——
0.0
0.0
0.0
0.0
ns
ns
HRIP_SET
HFRIP_SET
HFCIN_SET
HCIN_SET
HAS_SET
HRIPRC_SET
HFCINRC_SET
HCINRC_SET
HASRC_SET
1.74
0.90
1.21
1.68
4.70
1.37
1.03
1.48
4.51
1.51
0.78
1.05
1.46
4.09
1.19
0.90
1.29
3.92
ns
ns
ns
ns
ns
ns
ns
ns
ns
HFCINRC_HLD
——
0.0
0.0
0.0
0.0
ns
ns
Note: The table shows worst-case delay for the ripple chain. ORCAFoundry reports the delay for individual paths within the ripple chain
that will be less than or equal to those listed above.
相關(guān)PDF資料
PDF描述
OR3LP26B Field-Programmable System Chip,Embedded Master/Target PCI Bus Interface(現(xiàn)場(chǎng)可編程系統(tǒng)芯片,嵌入式主機(jī)/從機(jī)PCI總線接口)
OR4E10 Field-Programmable Gate Arrays(現(xiàn)場(chǎng)可編程門陣列)
OR4E14 Field-Programmable Gate Arrays(現(xiàn)場(chǎng)可編程門陣列)
OR4E2 Field-Programmable Gate Arrays(現(xiàn)場(chǎng)可編程門陣列)
OR4E4 Field-Programmable Gate Arrays(現(xiàn)場(chǎng)可編程門陣列)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
OR3L225B7BC432-DB 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 11552 LUT 612 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
OR3L225B7BC432I-DB 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 11552 LUT 612 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
OR3L225B7BM680-DB 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 11552 LUT 612 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
OR3L225B7BM680I-DB 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 11552 LUT 612 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
OR3L225B8BC432-DB 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 11552 LUT 612 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256