參數(shù)資料
型號: MC145574
廠商: Motorola, Inc.
英文描述: ISDN S/T-Interface Transceiver
中文描述: 綜合業(yè)務(wù)數(shù)字網(wǎng)S / T的接口收發(fā)器
文件頁數(shù): 135/164頁
文件大小: 1072K
代理商: MC145574
MC145574
19–3
MOTOROLA
PB SUFFIX
TQFP
CASE 873A–02
éé
éé
éé
éé
DETAIL Y
A
S1
V
B
1
8
9
17
25
32
AE
AE
P
DETAIL Y
BASE
D
SECTION AE–AE
G
SPLANE
R
Q
W
K
X
0
G
E
C
H
DETAIL AD
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUMPLANE –AB– IS LOCATED AT BOTTOMOF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOMOF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUMPLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUMPLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
8. MINIMUMSOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER MAY VARY
FROMDEPICTION.
DIM
A
A1
MIN
7.000 BSC
3.500 BSC
MAX
MIN
0.276 BSC
0.138 BSC
MAX
INCHES
MILLIMETERS
B
B1
7.000 BSC
3.500 BSC
0.276 BSC
0.138 BSC
C
D
E
F
G
H
J
K
M
N
P
Q
R
S
S1
1.400
0.300
1.350
0.300
0.800 BSC
0.050
0.090
0.500
12 REF
0.090
0.400 BSC
1
0.150
9.000 BSC
4.500 BSC
1.600
0.450
1.450
0.400
0.055
0.012
0.053
0.012
0.031 BSC
0.002
0.004
0.020
12 REF
0.004
0.016 BSC
1
0.006
0.354 BSC
0.177 BSC
0.063
0.018
0.057
0.016
0.150
0.200
0.700
0.006
0.008
0.028
0.160
0.006
5
5
0.250
0.010
V
V1
W
X
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
DETAIL AD
A1
B1
V1
4X
S
4X
9
–T–
–Z–
–U–
T–U
0.20 (0.008)
Z
AC
T–U
0.20 (0.008)
Z
AB
0.10 (0.004) AC
–AC–
–AB–
M
8X
T
M
0
Z
A
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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