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參數(shù)資料
| 型號： | celeron 700 |
| 廠商： | Intel Corp. |
| 英文描述： | Intel Celeron Processor Up To 700 MHz(頻率達700MHz的INTEL Celeron 處理器) |
| 中文描述： | 英特爾賽揚處理器高達700兆赫（頻率達700MHz的英特爾賽揚處理器的） |
| 文件頁數(shù)： | 99/118頁 |
| 文件大?。?/td> | 990K |
| 代理商： | CELERON 700 |
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Datasheet
99
Intel
Celeron Processor up to 700 MHz
6.0
Boxed Processor Specifications
The Intel
Celeron processor is also offered as an Intel boxed processor in the FC-PGA, PPGA,
and S.E.P. Package. Intel boxed processors are intended for system integrators who build systems
from motherboards and standard components. The boxed Celeron processor in the S.E.P. Package
is supplied with an attached fan heatsink. The boxed Celeron processors in FC-PGA and PPGA
packages are supplied with unattached fan heatsinks.
This section documents motherboard and system requirements for the fan heatsink that is supplied
with the boxed Intel Celeron processor. This section is particularly important for OEMs that
manufacture motherboards for system integrators. Unless otherwise noted, all figures in this
section are dimensioned in inches.
Note:
Drawings in this section reflect only the specifications of the Intel boxed processor product. These
dimensions should not be used as a generic keep-out zone for all heatsinks. It is the system
designer’s responsibility to consider their proprietary solution when designing to the required
keep-out zone on their system platform and chassis. Refer to the package specific
Thermal /
Mechanical Solution Functional Specifications
for further guidance. Contact your local Intel Sales
Representative for these documents.
6.1
Mechanical Specifications for the Boxed Intel
Celeron
Processor
6.1.1
Mechanical Specifications for the S.E.P. Package
This section documents the mechanical specifications of the boxed Intel
Celeron processor fan
heatsink in the S.E.P. Package. The boxed processor in the S.E.P. Package ships with an attached
fan heatsink.
Figure 25
shows a mechanical representation of the boxed Intel Celeron processor in
a S.E.P. Package in the retention mechanism, which is not shipped with the boxed Intel Celeron
processor.
The space requirements and dimensions for the boxed processor in the S.E.P. Package are shown in
Figure 26
and
Figure 27
. Also, a conceptual attachment interface to low profile retention
mechanism is shown in
Figure 35
.
Note:
The heatsink airflow keepout zones found in
Table 51
and
Figure 35
refer specifically to the boxed
processor’s active fan heatsink. This does not reflect the worst-case dimensions that may exist with
other third party passive or active fan heatsinks.
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參數(shù)描述 |
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| CELF001001J1 | 制造商:Panasonic Industrial Company 功能描述:FILTER |
| CELHK11-1REC5-59-3.00-AV-01-V | 功能描述:CIRCUIT BRKR MAG-HYDR LEVER 3A 制造商:sensata technologies/airpax 系列:CEL 零件狀態(tài):有效 斷路器類型:磁性（液力延遲） 額定電流:3A 額定電壓 - AC:- 額定電壓 - DC:- 極數(shù):2 致動器類型:搖臂 照明:- 照明電壓（標稱值）:- 安裝類型:面板安裝 標準包裝:1 |
| CELHK11-1REC5-59-35.0-AV-01-V | 功能描述:CIRCUIT BRKR MAG-HYDR LEVER 35A 制造商:sensata technologies/airpax 系列:CEL 零件狀態(tài):有效 斷路器類型:磁性（液力延遲） 額定電流:35A 額定電壓 - AC:- 額定電壓 - DC:- 極數(shù):2 致動器類型:搖臂 照明:- 照明電壓（標稱值）:- 安裝類型:面板安裝 標準包裝:1 |
| CELHK11-1REC5-71165-10-V | 功能描述:CIRCUIT BREAKER MAG-HYDR LEVER 制造商:sensata technologies/airpax 系列:* 零件狀態(tài):有效 標準包裝:1 |
| CELHK11-1REC5-71165-11-V | 功能描述:CIRCUIT BREAKER MAG-HYDR LEVER 制造商:sensata technologies/airpax 系列:* 零件狀態(tài):有效 標準包裝:1 |
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