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參數(shù)資料
| 型號(hào)： | celeron 700 |
| 廠商： | Intel Corp. |
| 英文描述： | Intel Celeron Processor Up To 700 MHz(頻率達(dá)700MHz的INTEL Celeron 處理器) |
| 中文描述： | 英特爾賽揚(yáng)處理器高達(dá)700兆赫（頻率達(dá)700MHz的英特爾賽揚(yáng)處理器的） |
| 文件頁數(shù)： | 104/118頁 |
| 文件大?。?/td> | 990K |
| 代理商： | CELERON 700 |
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104
Datasheet
Intel
Celeron Processor up to 700 MHz
6.1.2.1
Boxed Processor Heatsink Dimensions
NOTES:
1. Drawings reflect only the specifications of the Intel boxed processor product. These dimensions should not
be used as a universal keepout zone that covers all heatsinks. It is the system designer’s responsibility to
consider their own proprietary solution when designing the desired keepout zone in their system platform.
2. Applies to the heatsinks provided with the boxed Intel Celeron processors from 300A MHz to 433 MHz.
3. Applies to the heatsink provided with the Intel Celeron processors from 466 MHz to 533 MHz in the PPGA
package and the boxed Intel Celeron processors from 533A to 700 MHz in the FC-PGA package.
6.1.2.2
Boxed Processor Heatsink Weight
The heatsink for the boxed Intel Celeron processor in the PPGA package will not weigh more than
180 grams.
6.1.3
Mechanical Specifications for the FC-PGA Package
This section documents the mechanical specifications of the fan heatsink for the boxed Intel
Celeron processor in the FC-PGA (Flip-Chip Pin Grid Array) package. The boxed processor in the
FC-PGA package ships with a fan heatsink which has an integrated clip.
Figure 32
shows a
mechanical representation of the boxed Intel Celeron processor in the FC-PGA package.
The dimensions for the boxed processor with integrated fan heatsink are shown in
Figure 30
and
Figure 31
. General spatial specifications are also outlined in
Table 52
.
The fan heatsink is designed to allow visibility of the FC-PGA processor markings located on the
top of the package. The FC-PGA processor markings are visible after installation of the fan
heatsink due to notched sides of the heatsink base (See
Figure 33
). The boxed processor fan
heatsink is also asymmetrical in that the mechanical step feature (specified in
Figure 34
) must sit
over the socket’s cam. The step allows the heatsink to securely interface with the processor in order
to meet the processors thermal requirements.
Table 52. Boxed Processor Fan Heatsink Spatial Dimensions for the PPGA and FC-PGA
Packages
1
Dimensions (Inches)
Min
Typ
Max
Notes
Fan Heatsink Length (see Figure 28)
2.52
Fan Heatsink Height from Motherboard (see
Figure 27)
0.34
Fan Heatsink Height (see Figure 27)
1.22
1.77
2
3
Fan Heatsink Width (see Figure 28)
2.00
Airflow Keepout Zones from end of Fan Heatsink
0.20
Airflow Keepout Zones from face of Fan Heatsink
0.20
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| celeron cpu Mobile Module | processor Mobile Module Connector 1 (MMC-1) at 466 MHz and 433MHZ(工作頻率466和433兆赫茲帶連接器1處理器) |
| celeron CPU with Mobile Module | processor Mobile Module Connector 2 (MMC-2) at 466 MHz and 433MHZ(工作頻率466和433兆赫茲帶連接器2處理器) |
| Celeron Processor with mobile | Celeron Processor Mobile Module MMC-1 at 400 MHz, 366 MHz, 333 MHz, and 300 MHz(工作頻率400,366,333,300和266兆赫茲帶移動(dòng)模塊和連接器1處理器) |
| celeron processor | 32 bit Celeron Processor Mobile Module(32 位帶移動(dòng)模塊處理器) |
| CEM11C2 | Dual Enhancement Mode Field Effect Transistor (N and P Channel) |
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