參數(shù)資料
型號: celeron 700
廠商: Intel Corp.
英文描述: Intel Celeron Processor Up To 700 MHz(頻率達700MHz的INTEL Celeron 處理器)
中文描述: 英特爾賽揚處理器高達700兆赫(頻率達700MHz的英特爾賽揚處理器的)
文件頁數(shù): 106/118頁
文件大?。?/td> 990K
代理商: CELERON 700
106
Datasheet
Intel
Celeron Processor up to 700 MHz
6.1.3.1
Boxed Processor Heatsink Weight
The heatsink for the boxed Intel Celeron processor in the FC-PGA package will not weigh more
than 180 grams.
6.2
Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution utilized by the boxed
processors.
6.2.1
Thermal Requirements for the Boxed Intel
Celeron Processor
6.2.1.1
Boxed Processor Cooling Requirements
The boxed processor is directly cooled with a fan heatsink. However, meeting the processor’s
temperature specification is also a function of the thermal design of the entire system, and
ultimately the responsibility of the system integrator. The processor temperature specification is
found in
Section 4.0
of this document. The boxed processor fan heatsink is able to keep the
processor temperature within the specifications (see
Section 4.0
) in chassis that provide good
thermal management.
For the boxed processor fan heatsink to operate properly, it is critical that the airflow provided to
the fan heatsink is unimpeded. Airflow of the fan heatsink is into the center and out of the sides of
the fan heatsink. Airspace is required around the fan to ensure that the airflow through the fan
heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the cooling efficiency and
decreases fan life.
Figure 35
and
Figure 36
illustrate an acceptable airspace clearance for the fan
heatsink. It is also recommended that the air temperature entering the fan be kept below 45 °C.
Again, meeting the processor's temperature specification is the responsibility of the system
integrator. The processor temperature specification is found in
Section 4.0
of this document.
Figure 34. Dimensions of Mechanical Step Feature in Heatsink Base for the FC-PGA Package
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