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參數(shù)資料
| 型號： | celeron 700 |
| 廠商： | Intel Corp. |
| 英文描述： | Intel Celeron Processor Up To 700 MHz(頻率達(dá)700MHz的INTEL Celeron 處理器) |
| 中文描述： | 英特爾賽揚處理器高達(dá)700兆赫（頻率達(dá)700MHz的英特爾賽揚處理器的） |
| 文件頁數(shù)： | 5/118頁 |
| 文件大?。?/td> | 990K |
| 代理商： | CELERON 700 |
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Datasheet
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Intel
Celeron Processor up to 700 MHz
Figures
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Clock Control State Machine...............................................................................14
BCLK to Core Logic Offset..................................................................................40
BCLK*, PICCLK, and TCK Generic Clock Waveform .........................................40
System Bus Valid Delay Timings ........................................................................41
System Bus Setup and Hold Timings..................................................................41
System Bus Reset and Configuration Timings
(For the S.E.P. and PPGA Packages).................................................................41
System Bus Reset and Configuration Timings (For the FC-PGA Package) .......42
Power-On Reset and Configuration Timings.......................................................42
Test Timings (TAP Connection)..........................................................................43
Test Reset Timings .............................................................................................43
BCLK, TCK, PICCLK Generic Clock Waveform at the Processor Core Pins .....45
BCLK, TCK, PICCLK Generic Clock Waveform at the
Processor Edge Fingers......................................................................................46
Low to High AGTL+ Receiver Ringback Tolerance.............................................48
Non-AGTL+ Overshoot/Undershoot, Settling Limit, and Ringback .....................49
Maximum Acceptable AGTL+ Overshoot/Undershoot Waveform
(FC-PGA Package) .............................................................................................55
Processor Functional Die Layout ........................................................................58
Processor Substrate Dimensions (S.E.P. Package) ...........................................61
Processor Substrate Primary/Secondary Side Dimensions (S.E.P. Package)....61
Package Dimensions (PPGA Package)..............................................................70
PPGA Package (Pin Side View)..........................................................................72
Package Dimensions (FC-PGA Package)...........................................................83
Top Side Processor Markings (PPGA and FC-PGA Packages) .........................85
Package Dimensions (FC-PGA Package)...........................................................86
Retention Mechanism for the Boxed Intel Celeron
Processor in the S.E.P. Package......................................................................100
Side View Space Requirements for the Boxed Processor
in the S.E.P. Package .......................................................................................100
Front View Space Requirements for the Boxed Processor
the S.E.P. Package...........................................................................................101
Boxed Intel Celeron Processor in the PPGA Package................................102
Side View Space Requirements for the Boxed Processor
in the PPGA Package........................................................................................102
Top View Space Requirements for the Boxed Processor in
the FC-PGA and PPGA Packages....................................................................103
Side View Space Requirements for the Boxed Processor
‘in the FC-PGA and PPGA Packages ...............................................................103
Boxed Intel
Celeron processor in the 370-pin socket (FC-PGA Package) ..105
Dimensions of Notches in Heatsink Base .........................................................105
Dimensions of Mechanical Step Feature in Heatsink
Base for the FC-PGA Package .........................................................................106
Top View Airspace Requirements for the Boxed Processor
in the S.E.P. Package .......................................................................................107
Side View Airspace Requirements for the Boxed Intel Celeron
Processor in the FC-PGA and PPGA packages ...............................................107
Clip Keepout Requirements for the 370-Pin (Top View) ...................................108
Boxed Processor Fan Heatsink Power Cable Connector Description...............109
Motherboard Power Header Placement for the S.E.P. Package.......................109
Motherboard Power Header Placement Relative to the 370-pin Socket...........110
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相關(guān)PDF資料 |
PDF描述 |
|---|---|
| celeron cpu Mobile Module | processor Mobile Module Connector 1 (MMC-1) at 466 MHz and 433MHZ(工作頻率466和433兆赫茲帶連接器1處理器) |
| celeron CPU with Mobile Module | processor Mobile Module Connector 2 (MMC-2) at 466 MHz and 433MHZ(工作頻率466和433兆赫茲帶連接器2處理器) |
| Celeron Processor with mobile | Celeron Processor Mobile Module MMC-1 at 400 MHz, 366 MHz, 333 MHz, and 300 MHz(工作頻率400,366,333,300和266兆赫茲帶移動模塊和連接器1處理器) |
| celeron processor | 32 bit Celeron Processor Mobile Module(32 位帶移動模塊處理器) |
| CEM11C2 | Dual Enhancement Mode Field Effect Transistor (N and P Channel) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CELF001001J1 | 制造商:Panasonic Industrial Company 功能描述:FILTER |
| CELHK11-1REC5-59-3.00-AV-01-V | 功能描述:CIRCUIT BRKR MAG-HYDR LEVER 3A 制造商:sensata technologies/airpax 系列:CEL 零件狀態(tài):有效 斷路器類型:磁性（液力延遲） 額定電流:3A 額定電壓 - AC:- 額定電壓 - DC:- 極數(shù):2 致動器類型:搖臂 照明:- 照明電壓（標(biāo)稱值）:- 安裝類型:面板安裝 標(biāo)準(zhǔn)包裝:1 |
| CELHK11-1REC5-59-35.0-AV-01-V | 功能描述:CIRCUIT BRKR MAG-HYDR LEVER 35A 制造商:sensata technologies/airpax 系列:CEL 零件狀態(tài):有效 斷路器類型:磁性（液力延遲） 額定電流:35A 額定電壓 - AC:- 額定電壓 - DC:- 極數(shù):2 致動器類型:搖臂 照明:- 照明電壓（標(biāo)稱值）:- 安裝類型:面板安裝 標(biāo)準(zhǔn)包裝:1 |
| CELHK11-1REC5-71165-10-V | 功能描述:CIRCUIT BREAKER MAG-HYDR LEVER 制造商:sensata technologies/airpax 系列:* 零件狀態(tài):有效 標(biāo)準(zhǔn)包裝:1 |
| CELHK11-1REC5-71165-11-V | 功能描述:CIRCUIT BREAKER MAG-HYDR LEVER 制造商:sensata technologies/airpax 系列:* 零件狀態(tài):有效 標(biāo)準(zhǔn)包裝:1 |
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