參數(shù)資料
型號: celeron 700
廠商: Intel Corp.
英文描述: Intel Celeron Processor Up To 700 MHz(頻率達(dá)700MHz的INTEL Celeron 處理器)
中文描述: 英特爾賽揚(yáng)處理器高達(dá)700兆赫(頻率達(dá)700MHz的英特爾賽揚(yáng)處理器的)
文件頁數(shù): 10/118頁
文件大?。?/td> 990K
代理商: CELERON 700
10
Datasheet
Intel
Celeron Processor up to 700 MHz
1.1.1
Package Terminology
The following terms are used often in this document and are explained here for clarification:
Processor substrate
—The structure on which passive components (resistors and capacitors)
are mounted.
Processor core
—The processor’s execution engine.
S.E.P. Package
—Single-Edge Processor Package, which consists of a processor substrate,
processor core, and passive components. This package differs from the S.E.C. Cartridge as this
processor has no external plastic cover, thermal plate, or latch arms.
PPGA package—
Plastic Pin Grid Array package. The package is a pinned laminated printed
circuit board structure.
FC-PGA
- Flip-Chip Pin Grid Array. The FC-PGA uses the same 370-pin zero insertion force
socket (PGA370) as the PPGA. Thermal solutions are attached directly to the back of the
processor core package without the use of a thermal plate or heat spreader.
Keep-out zone
- The area on or near a FC-PGA packaged processor that system designs can
not utilize.
Keep-in zone
- The area of a FC-PGA packaged processor that thermal solutions may utilize.
Additional terms referred to in this and other related documentation:
SC242
—242-contact slot connector. A processor in the S.E.P. Package uses this connector to
interface with a system board.
370-pin socket (PGA370)—
The zero insertion force (ZIF) socket in which a processor in the
PPGA package will use to interface with a system board.
Retention mechanism
—A mechanical assembly which holds the package in the SC242
connector.
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