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參數(shù)資料
| 型號(hào)： | celeron 700 |
| 廠商： | Intel Corp. |
| 英文描述： | Intel Celeron Processor Up To 700 MHz(頻率達(dá)700MHz的INTEL Celeron 處理器) |
| 中文描述： | 英特爾賽揚(yáng)處理器高達(dá)700兆赫（頻率達(dá)700MHz的英特爾賽揚(yáng)處理器的） |
| 文件頁(yè)數(shù)： | 56/118頁(yè) |
| 文件大?。?/td> | 990K |
| 代理商： | CELERON 700 |
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56
Datasheet
Intel
Celeron Processor up to 700 MHz
4.0
Thermal Specifications and Design Considerations
This section provides needed data for designing a thermal solution. However, for the correct
thermal measuring processes, refer to AP-905,
Intel
Pentium
III
Processor Thermal Design
Guidelines
(Order Number 245087). For the FC-PGA using flip chip pin grid array packaging
technology, Intel specifies the
junction
temperature (T
junction
). For the S.E.P. package and PPGA
package, Intel specifies the
case
temperature (T
case
).
4.1
Thermal Specifications
Table 36
and
Table 37
provide both the Processor Power and Heat Sink Design Target for Intel
Celeron processors. Processor Power is defined as the total power dissipated by the processor
core and its package. Therefore, the S.E.P. Package’s Processor Power would also include power
dissipated by the AGTL+ termination resistors. The overall system chassis thermal design must
comprehend the entire Processor Power. The Heat Sink Design Target consists of only the
processor core, which dissipates the majority of the thermal power.
Systems should design for the highest possible thermal power, even if a processor with a lower
thermal dissipation is planned. The processor’s heatslug is the attach location for all thermal
solutions. The maximum and minimum case temperatures are also specified in
Table 36
and
Table 37
. A thermal solution should be designed to ensure the temperature of the case never
exceeds these specifications. Refer to the “developer.intel.com” site for more information.
NOTES:
1. These values are specified at nominal V
CCCORE
for the processor core.
2.
Processor Power is power generated from the S.E.P. Package’s substrate, which includes the processor
core and the AGTL+ termination resistors.
3. Heat Sink Design Target refers to the power consumption of the processor core.
Table 36. Processor Power for the S.E.P. Package
1
Processor Core
Frequency
(MHz)
L2 Cache
Size
(KB)
Processor
(W)2
Heat Sink
Desi(W)3
Minimum T
CASE
(°C)
Maximum T
CASE
(°C)
266
0
16.6
16.0
5
85
300
0
18.4
17.8
5
85
300A
128
18.4
17.8
5
85
333
128
20.2
19.7
5
85
366
128
22.2
21.7
5
85
400
128
24.2
23.7
5
85
433
128
24.6
24.1
5
85
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