參數(shù)資料
型號: celeron 700
廠商: Intel Corp.
英文描述: Intel Celeron Processor Up To 700 MHz(頻率達700MHz的INTEL Celeron 處理器)
中文描述: 英特爾賽揚處理器高達700兆赫(頻率達700MHz的英特爾賽揚處理器的)
文件頁數(shù): 6/118頁
文件大?。?/td> 990K
代理商: CELERON 700
Intel
Celeron Processor up to 700 MHz
6
Datasheet
Tables
1
2
3
4
5
6
7
8
9
Processor Identification.......................................................................................11
Voltage Identification Definition ..........................................................................18
Intel
Celeron Processor System Bus Signal Groups.....................................20
Absolute Maximum Ratings ...............................................................................22
Voltage and Current Specifications ....................................................................23
AGTL+ Signal Groups DC Specifications ...........................................................27
Non-AGTL+ Signal Group DC Specifications
.....................................................28
Processor AGTL+ Bus Specifications ................................................................29
System Bus AC Specifications (Clock) at the Processor
Edge Fingers (for S.E.P. Package)
....................................................................30
System Bus AC Specifications (Clock) at the Processor
Core Pins (for Both S.E.P. and PGA Packages) ................................................31
Valid Intel
Celeron Processor System Bus, Core Frequency
.......................32
System Bus AC Specifications (AGTL+ Signal Group) at the
Processor Edge Fingers (for S.E.P. Package)....................................................32
System Bus AC Specifications (AGTL+ Signal Group) at
the Processor Core Pins (for S.E.P. Package) ..................................................33
Processor System Bus AC Specifications (AGTL+ Signal Group)
at the Processor Core Pins (for PPGA Package) ...............................................33
System Bus AC Specifications (AGTL+ Signal Group) at the
Processor Core Pins (for FC-PGA Package)......................................................34
System Bus AC Specifications (CMOS Signal Group) at the
Processor Edge Fingers (for S.E.P. Package) ...................................................34
System Bus AC Specifications (CMOS Signal Group) at
the Processor Core Pins (for Both S.E.P. and PGA Packages) .........................35
System Bus AC Specifications (Reset Conditions)
(for Both S.E.P. and PPGA Packages) ..............................................................35
System Bus AC Specifications (Reset Conditions)
(for the FC-PGA Package) .................................................................................36
System Bus AC Specifications (APIC Clock and APIC I/O)
at the Processor Edge Fingers (for S.E.P. Package) .........................................36
System Bus AC Specifications (APIC Clock and APIC I/O)
at the Processor Core Pins (For S.E.P. and PGA Packages)
............................37
System Bus AC Specifications (TAP Connection) at the
Processor Edge Fingers (For S.E.P. Package) ..................................................38
System Bus AC Specifications (TAP Connection) at the
Processor Core Pins (for Both S.E.P. and PPGA Packages) ............................39
BCLK Signal Quality Specifications for Simulation at the Processor Core
(for Both S.E.P. and PPGA Packages)...............................................................44
BCLK/PICCLK Signal Quality Specifications for Simulation
at the Processor Pins (for the FC-PGA Package) ..............................................45
BCLK Signal Quality Guidelines for Edge Finger Measurement
(for the S.E.P. Package) ....................................................................................46
AGTL+ Signal Groups Ringback Tolerance Specifications at the
Processor Core (For Both the S.E.P. and PPGA Packages)..............................47
AGTL+ Signal Groups Ringback Tolerance Specifications at
the Processor Pins (For FC-PGA Packages) .....................................................47
AGTL+ Signal Groups Ringback Tolerance Guidelines for Edge Finger
Measurement on the S.E.P. Package ................................................................48
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
相關PDF資料
PDF描述
celeron cpu Mobile Module processor Mobile Module Connector 1 (MMC-1) at 466 MHz and 433MHZ(工作頻率466和433兆赫茲帶連接器1處理器)
celeron CPU with Mobile Module processor Mobile Module Connector 2 (MMC-2) at 466 MHz and 433MHZ(工作頻率466和433兆赫茲帶連接器2處理器)
Celeron Processor with mobile Celeron Processor Mobile Module MMC-1 at 400 MHz, 366 MHz, 333 MHz, and 300 MHz(工作頻率400,366,333,300和266兆赫茲帶移動模塊和連接器1處理器)
celeron processor 32 bit Celeron Processor Mobile Module(32 位帶移動模塊處理器)
CEM11C2 Dual Enhancement Mode Field Effect Transistor (N and P Channel)
相關代理商/技術參數(shù)
參數(shù)描述
CELF001001J1 制造商:Panasonic Industrial Company 功能描述:FILTER
CELHK11-1REC5-59-3.00-AV-01-V 功能描述:CIRCUIT BRKR MAG-HYDR LEVER 3A 制造商:sensata technologies/airpax 系列:CEL 零件狀態(tài):有效 斷路器類型:磁性(液力延遲) 額定電流:3A 額定電壓 - AC:- 額定電壓 - DC:- 極數(shù):2 致動器類型:搖臂 照明:- 照明電壓(標稱值):- 安裝類型:面板安裝 標準包裝:1
CELHK11-1REC5-59-35.0-AV-01-V 功能描述:CIRCUIT BRKR MAG-HYDR LEVER 35A 制造商:sensata technologies/airpax 系列:CEL 零件狀態(tài):有效 斷路器類型:磁性(液力延遲) 額定電流:35A 額定電壓 - AC:- 額定電壓 - DC:- 極數(shù):2 致動器類型:搖臂 照明:- 照明電壓(標稱值):- 安裝類型:面板安裝 標準包裝:1
CELHK11-1REC5-71165-10-V 功能描述:CIRCUIT BREAKER MAG-HYDR LEVER 制造商:sensata technologies/airpax 系列:* 零件狀態(tài):有效 標準包裝:1
CELHK11-1REC5-71165-11-V 功能描述:CIRCUIT BREAKER MAG-HYDR LEVER 制造商:sensata technologies/airpax 系列:* 零件狀態(tài):有效 標準包裝:1