參數(shù)資料
型號(hào)： celeron 700
廠商： Intel Corp.
英文描述： Intel Celeron Processor Up To 700 MHz(頻率達(dá)700MHz的INTEL Celeron 處理器)
中文描述： 英特爾賽揚(yáng)處理器高達(dá)700兆赫（頻率達(dá)700MHz的英特爾賽揚(yáng)處理器的）
文件頁數(shù)： 60/118頁
文件大?。?/td> 990K
代理商： CELERON 700
60
Datasheet
Intel
Celeron Processor up to 700 MHz
5.0
Mechanical Specifications
There are three package technologies which Intel
Celeron processors use. They are the S.E.P.
Package, the PPGA package, and the FC-PGA package. The S.E.P. Package and FC-PGA package
contain the processor core and passive components, while the PPGA package does not have
passive components.
The processor edge connector defined in this document is referred to as the “SC242 connector.”
See the
SC242 Design Guidelines
(Order Number 243397) for further details on the edge
connector.
The processor socket connector is defined in this document is referred to as the “370-pin socket.”
See the
370-Pin Socket (PGA370) Design Guidelines
(Order Number 244410) for further details on
the socket.
5.1
S.E.P. Package
This section defines the mechanical specifications and signal definitions for the Intel
Celeron
processor in the S.E.P. Package.
5.1.1
Materials Information
The Intel
Celeron processor requires a retention mechanism. This retention mechanism may
require motherboard holes to be 0.159" diameter if low cost plastic fasteners are used to secure the
retention mechanisms. The larger diameter holes are necessary to provide a robust structural design
that can shock and vibe testing. If captive nuts are used in place of the plastic fasteners, then either
the 0.159" or the 0.140" diameter holes will suffice as long as the attach mount is used.
Figure 18
with substrate dimensions is provided to aid in the design of a heat sink and clip. In
Figure 19
all area on the secondary side of the substrate is zoned “keep out”, except for 25 mils
around the tooling holes and the top and side edges of the substrate.
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