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參數(shù)資料
| 型號： | NAND08GW3B2CZL1F |
| 廠商： | NUMONYX |
| 元件分類： | PROM |
| 英文描述： | 1G X 8 FLASH 3V PROM, 25000 ns, PBGA52 |
| 封裝： | 12 X 17 MM, 1 MM PITCH, LEAD FREE, LGA-52 |
| 文件頁數(shù)： | 29/72頁 |
| 文件大小： | 1919K |
| 代理商： | NAND08GW3B2CZL1F |
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NAND04G-B2D, NAND08G-BxC
Device operations
6.9
Error detection code (EDC)
The EDC (error detection code) is performed automatically during all program operations. It
starts immediately after the device becomes busy.
The EDC detects 1 single bit error per EDC unit. Each EDC unit has a density of 528 bytes
(or 264 words), split into 512 bytes of main area and 16 bytes of spare area (or
results can only be retrieved during copy back program and multiplane copy back operations
using the Read EDC Status Register command (see Section 6.13: Read EDC status
To properly use the EDC, the following conditions apply:
●
Page program operations must be performed on a whole page, or on whole EDC unit(s)
●
The modification of the content of an EDC unit using a random data input before the
copy back program, must be performed on the whole EDC unit. It can only be done
once per EDC unit. Any partial modification of the EDC unit results in the corruption of
the on-chip EDCs.
Figure 20.
Page organization
AI13179b
A area
(512 bytes/
256 words)
Main area (2048 bytes/1024 words)
Spare area (64 bytes/32 words)
Page = 4 EDC units
B area
(512 bytes/
256 words)
C area
(512 bytes/
256 words)
D area
(512 bytes/
256 words)
E area
(16 bytes/
8 words)
F area
(16 bytes/
8 words)
G area
(16 bytes/
8 words)
H area
(16 bytes/
8 words)
Table 12.
Address definition for EDC units (x8 devices)
EDC unit
Main area
Spare area
Area name
Column address
Area name
Column address
1st 528-byte EDC unit
A
0 to 511
E
2048 to 2063
2nd 528-byte EDC unit
B
512 to 1023
F
2064 to 2079
3rd 528-byte EDC unit
C
1024 to1535
G
2080 to 2095
4th 528-byte EDC unit
D
1536 to 2047
H
2096 to 2111
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| NAND128W3A2BV6E | 16M X 8 FLASH 3V PROM, 12000 ns, PDSO48 |
| NAND512R3A2CV6E | 64M X 8 FLASH 1.8V PROM, 15000 ns, PDSO48 |
| NAND128W4A2CZA6E | 8M X 16 FLASH 3V PROM, 35 ns, PBGA55 |
| NAND128R4A2BZA6E | 8M X 16 FLASH 1.8V PROM, 35 ns, PBGA55 |
| NAND256R4A0DN6T | 16M X 16 FLASH 1.8V PROM, 15000 ns, PDSO48 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| NAND08GW3B4BN6E | 制造商:Micron Technology Inc 功能描述:NAND - Trays |
| NAND08GW3B4BN6F | 制造商:Micron Technology Inc 功能描述:NAND - Tape and Reel |
| NAND08GW3B4CN1F | 制造商:Micron Technology Inc 功能描述:NAND - Trays |
| NAND08GW3B4CZL6E | 制造商:Micron Technology Inc 功能描述:NAND - Trays |
| NAND08GW3C2AE01 | 功能描述:閃存 NAND & S.MEDIA FLASH RoHS:否 制造商:ON Semiconductor 數(shù)據(jù)總線寬度:1 bit 存儲類型:Flash 存儲容量:2 MB 結(jié)構(gòu):256 K x 8 定時類型: 接口類型:SPI 訪問時間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
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