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| 型號： | MC68HC16Z1VEH16 |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 7/56頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MCU 16BIT 1K FLASH 132-PQFP |
| 標(biāo)準(zhǔn)包裝： | 36 |
| 系列： | HC16 |
| 核心處理器： | CPU16 |
| 芯體尺寸： | 16-位 |
| 速度： | 16MHz |
| 連通性： | EBI/EMI，SCI，SPI |
| 外圍設(shè)備： | POR，PWM，WDT |
| 輸入/輸出數(shù)： | 16 |
| 程序存儲器類型： | ROMless |
| RAM 容量： | 1K x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 2.7 V ~ 5.5 V |
| 數(shù)據(jù)轉(zhuǎn)換器： | A/D 8x10b |
| 振蕩器型： | 內(nèi)部 |
| 工作溫度： | -40°C ~ 105°C |
| 封裝/外殼： | 132-BQFP 緩沖式 |
| 包裝： | 托盤 |
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2.7.1.1 Using LVI Devices with External Oscillators
An LVI device provides an extra degree of protection when an external oscillator that has an indepen-
dent power supply is used to generate the system clock. In this case, the LVI device ensures that the
oscillator does not power up before the MCU.
2.7.1.2 Using LVI Devices with Multiple Power Supplies
Take special precautions when system components that are connected to each other have separate
power supplies. Generally, one power supply will reach operating voltage more quickly than another. A
device connected to this fast supply can begin to operate before devices connected to a slower supply
have reached operating voltage. If a device connected to a fast supply drives logic one levels to a device
connected to a slow supply, the input protection diodes of the slow -starting device can be momentarily
forward biased, and significant current can be injected into the device substrate. In the case of an MCU,
the injected current can cause internal nodes to be improperly charged or discharged. Since this action
is random, it is impossible to predict what will happen when injection occurs. Usually, the processor will
fail to fetch opcodes. Figure 9 shows how to use LVI devices to prevent this problem. Each power sup-
ply is monitored by a separate LVI device. Signals from other boards are inhibited until correct operating
voltage is applied.
Figure 9 Using LVI Devices with Multiple Power Supplies
2.8 Designing for Electromagnetic Compatibility
Because of the fast clock speed and relatively short rise and fall times of MCU signals, the designer
must consider electromagnetic compatibility (EMC) issues. All high-speed digital devices radiate noise,
and if FCC compliance is required, the designer must do everything possible to limit emissions from the
MCU. Use of a four-layer board is probably the best single option the designer has. Although a two-layer
board will work, a multilayer PCB is much more effective at both protecting the MCU from emissions,
and reducing emissions from the MCU. EMC compatibility is a complex topic, and this tutorial can
present only a brief overview of EMC design techniques.
2.8.1 Reducing Power Supply Noise
The MCU is very susceptible to noise created by large or rapid uctuations in current through a partic-
ular power supply pin. The power supply pins are divided up into VDDE/VSSE and VDDI/VSSI. The VDDE/
VSSE pins power the external drivers and pins, while the VDDI/VSSI pins power the internal peripherals
and core of the MCU. It is very important to keep the VDDI/VSSI pins free of noise as the CPU is generally
332TUT DUAL RESET CONN
POWER SUPPLY
LOW
VOLTAGE
INHIBIT
DEVICE A
DEVICE B
LOW
VOLTAGE
INHIBIT
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For More Information On This Product,
Go to: www.freescale.com
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