參數(shù)資料
型號(hào): MC92604ZT
廠商: Freescale Semiconductor
文件頁數(shù): 96/122頁
文件大小: 0K
描述: IC TXRX ETH DUAL GIG 196-MAPBGA
標(biāo)準(zhǔn)包裝: 630
類型: 收發(fā)器
驅(qū)動(dòng)器/接收器數(shù): 2/2
規(guī)程: 千兆位以太網(wǎng)
電源電壓: 4.5 V ~ 5.5 V
安裝類型: 表面貼裝
封裝/外殼: 196-LBGA
供應(yīng)商設(shè)備封裝: 196-MAPBGA(15x15)
包裝: 托盤
System Design Considerations
MC92604 Dual Gigabit Ethernet Transceiver Reference Manual, Rev. 1
Freescale Semiconductor
5-7
5.9
Power Supply Decoupling Recommendations
The MC92604 requires a clean, tightly regulated source of power to ensure low jitter on transmit, and
reliable recovery of data in the receiver. An appropriate decoupling scheme is outlined below.
Only surface mount technology (SMT) capacitors should be used, in order to minimize inductance.
Connections from all capacitors to power and ground should be done with multiple vias to further reduce
inductance.
First, the board should have about 10
× 10-nF SMT ceramic chip capacitors as close as possible to the
1.8-V (VDD and XVDD) balls of the device. The board should also have about 10 × 10 nF SMT ceramic
chip capacitors as close as possible to the VDDQ balls of the device. Where the board has blind vias, these
capacitors should be placed directly below the MC92604 supply and ground connections. Where the board
does not have blind vias, these capacitors should be placed in a ring around the MC92604, as close to the
supply and ground connections as possible.
Second, there should be a 1-
F ceramic chip capacitor on each side of the MC92604 device. This should
be done for both the 1.8-V supply and the VDDQ supply.
Finally, there should be a 10-
F low equivalent series resistance (ESR) SMT tantalum chip capacitor and
a 100-
F low ESR SMT tantalum chip capacitor between the MC92604 device and the voltage regulator.
This should be done for both the 1.8-V supply and the VDDQ supply.
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