參數(shù)資料
型號： PCF5083
廠商： NXP Semiconductors N.V.
英文描述： STEEL COVER
中文描述： GSM信號處理IC
文件頁數(shù)： 63/136頁
文件大?。?/td> 602K
代理商： PCF5083
1996 Oct 29
63
Philips Semiconductors
Objective specification
GSM signal processing IC
PCF5083
9.3
GSM baseband procedures
The baseband procedures with optional input parameters can be called by the EXEC_PROC command as described in
Section 9.2. Return values are packed in the PROC_RETURN indication. Every procedure deals with the following types
of data:
Input parameters which are directly supplied by the System Controller
Return values which are automatically sent to the System Controller as soon as the procedure is completed
Input and output data buffers located in the DSP data RAM. They are used for communication with other procedures.
Most of the procedures use a common buffer SCRATCH_BUFF for their input and output data. Only a small number
of procedures need specific buffer for input or output. In this case there are one or two additional parameters in_buff_id
or out_buff_id which determine the buffers where input and output data are located. In Table 55 a list of all available
buffers is given.
For all trailing parameters of a procedure which are not transmitted with the EXEC_PROC command a default value of
zero is used.
Table 55
Data buffers for baseband procedures
Notes
1.
X = don’t care.
MNEMONIC
ID
(1)
SIZE
DESCRIPTION
VERSION_BUFF
0X8000
10
Contains the BCD coded version numbers of all software packages (order:
MP, BB, CI, CM, DB, EM, FB, SP and TP). A version number 0Xmm.ss
means version mm.ss.
Scratch buffer for communication between arbitrary modules.
The combination of the 4 buffers; TCH_CMI_BUFF1 to TCH_CMI_BUFF4.
Used to store the CMI values of 4 consecutive bursts belonging to one TCH
block.
SCRATCH_BUFF
TCH_CMI_BUFF
TCH_CMI_BUFF1
TCH_CMI_BUFF2
TCH_CMI_BUFF3
TCH_CMI_BUFF4
CCH_CMI_BUFF
CCH_CMI_BUFF1
CCH_CMI_BUFF2
CCH_CMI_BUFF3
CCH_CMI_BUFF4
CCH_INFO_BUFF
0X8001
0X8002
0X8003
0X8004
0X8005
0X8006
0X8007
0X8008
0X8009
0X800A
0X800B
0X800C
167
116
29
29
29
29
116
29
29
29
29
32
The combination of the 4 buffers; CCH_CMI_BUFF1 to CCH_CMI_BUFF4.
Used to store the CMI values of 4 consecutive bursts belonging to one
CCH block.
The combination of the 4 buffers;
CCH_INFO_BUFF1 to CCH_INFO_BUFF4.
Used to store the information bits 4 bursts belonging to one CCH block.
CCH_INFO_BUFF1
CCH_INFO_BUFF2
CCH_INFO_BUFF3
CCH_INFO_BUFF4
TCH_LOOP_BUFF
0X800D
0X800E
0X800F
0X8010
0X8011
8
8
8
8
82
Used to store four normal bursts during TCH loop-back operation. Note this
buffer is also used by the speech encoder.
Used to control several features of the firmware; see Table 56.
Used to store I and Q components from the PCF5072. This buffer is
overlaid with SCRATCH_BUFF.
MP_CONTROL_BUFF
IQ_BUFF
0X8013
0X8018
6
334
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PCF5083H/001/F2 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:GSM signal processing IC
PCF5083H/5V2/F3 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:GSM signal processing IC
PCF5083H/F2 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:GSM signal processing IC
PCF51AC128ACFUE 功能描述:32位微控制器 - MCU 32 Bit 128K FLASH 32K RAM CAN EN RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
PCF51AC128ACLKE 功能描述:32位微控制器 - MCU 32 Bit 128K FLASH 32K RAM CAN EN RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
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