參數(shù)資料
型號: ORT8850L-3BM680C
廠商: Lattice Semiconductor Corporation
文件頁數(shù): 72/105頁
文件大?。?/td> 0K
描述: IC FPSC TRANSCEIVER 8CH 680-BGA
產(chǎn)品變化通告: Product Discontinuation 01/Aug/2011
標(biāo)準(zhǔn)包裝: 24
系列: *
Lattice Semiconductor
ORCA ORT8850 Data Sheet
69
Electrical Characteristics
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the operations sections of this data sheet. Exposure to absolute maximum ratings for extended
periods can adversely affect device reliability.
The
ORCA Series 4 FPSCs include circuitry designed to protect the chips from damaging substrate injection cur-
rents and to prevent accumulations of static charge. Nevertheless, conventional precautions should be observed
during storage, handling, and use to avoid exposure to excessive electrical stress.
Table 20. Absolute Maximum Ratings
Recommended Operating Conditions
Table 21. Recommended Operating Conditions
For FPGA Recommended Operating Conditions and Electrical Characteristics, see the Recommended Operating
Conditions and Electrical Characteristics tables in the ORCA Series 4 FPGA data sheet (ORT8850L: OR4E02,
ORT8850H: OR4E06) and the ORCA Series 4 I/O Buffer Technical Note. FPSC Standby Currents (IDDSB15 and
IDDSB33) are tested with the Embedded Core in the powered down state.
Notes:
1. VDDA_STM is an analog power supply input which needs to be isolated from other power supplies on the board.
2. VDD33 is an analog power supply for the FPGA PLLs and needs to be isolated from other power supplies on the board.
Parameter
Symbol
Min.
Max.
Units
Storage Temperature
Tstg
-65
150
°C
Power Supply Voltage with Respect to Ground
VDD33
2
-0.3
4.2
V
VDDIO
-0.3
4.2
V
VDD15
-0.3
2.0
V
VDDA_STM
1
-0.3
2.0
V
Input Signal with Respect to Ground
-0.3
VDDIO + 0.3
V
Signal Applied to High-impedance Output
-0.3
VDDIO + 0.3
V
Maximum Package Body (Soldering) Temperature
220
°C
Parameter
Symbol
Min.
Max.
Units
Power Supply Voltage with Respect to Ground*
VDD33
2
2.7
3.6
V
VDD15
1.425
1.575
V
VDDA_STM
1
1.425
1.575
V
Input Voltages
VIN
-0.3
VDDIO + 0.3
V
Junction Temperature
TJ
-40
125
°C
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