19-4750; Rev 1; 07/11 151 of 194 Table 10-41. Valid UDP BID Location and UDP Protocol Type Settings UDP BID Loca" />
參數(shù)資料
型號(hào)： DS34S132GN+
廠商： Maxim Integrated Products
文件頁(yè)數(shù)： 59/194頁(yè)
文件大小： 0K
描述： IC TDM OVER PACKET 676-BGA
產(chǎn)品培訓(xùn)模塊： Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝： 40
功能： TDM-over-Packet（TDMoP）
接口： TDMoP
電路數(shù)： 1
電源電壓： 1.8V, 3.3V
工作溫度： -40°C ~ 85°C
安裝類(lèi)型： 表面貼裝
封裝/外殼： 676-BGA
供應(yīng)商設(shè)備封裝： 676-PBGA（27x27）
包裝： 管件
其它名稱(chēng)： 90-34S13+2N0
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DS34S132 DATA SHEET
19-4750; Rev 1; 07/11
151 of 194
Table 10-41. Valid UDP BID Location and UDP Protocol Type Settings
UDP BID Location Test
Mode
BID Test Settings
Protocol Test Settings
UDP Protocol Type Test Location
PC.CR1
UBIDLS
PC.CR1
UBIDLCE
B.BCDR4.
RXUBIDLS
PC.CR1.
UPVCE
PC.CR1.
DPS5
1
A
All Bundles:
“16-bit auto discover”
0
UDP Protocol is Ignored
1
0/1
For BID & OAM BID: 16-bit auto-discover2
B
Per-Bundle setting:
“16-bit Source Port” 1
0
1
0
UDP Protocol is Ignored
1
0/1
For BID: 16-bit Destination Port
For OAM BID: auto-discover2
Per-Bundle setting:
“16-bit Destination Port” 1
0
1
0
UDP Protocol is Ignored
1
0/1
For BID: 16-bit Source Port
For OAM BID: auto-discover2
C
All Bundles:
“16-bit Destination Port”
1
0
UDP Protocol is Ignored
1
0/1
For BID & OAM BID: 16-bit Source Port
D
All Bundles:
“16-bit Source Port”
2
0
UDP Protocol is Ignored
1
0/1
For BID & OAM BID: 16-bit Destination Port
E All Bundles: “32-bit”
3
0
UDP Protocol is Ignored
Notes: 1 The BID test location for the Per-Bundle tests are programmed per Bundle using B.BCDR4.RXUBIDLS.
2 The BID is auto discovered and the UPVC1/UPVC2 test is performed on the “other” UDP Port position.
10.4.2 Bundle and OAM Bundle Settings
Table 10-42. Bundle and OAM Bundle Control Registers (B.)
Register
Bits
Functional Description
Comments
Bundle Reset Control
BRCR1
SNS
Sequence Number Seed
RESET Bundle: To Reset an RXP Bundle payload data path, first select the
Bundle reset direction (“RXP only”, “TXP only”, “RXP and TXP” or “none”) using
RXBRE and TXBRE (1 = reset; 0 = release = no reset). When the Bundle number
(0-255) is written to RXTXBS, the Bundle will be reset. The Reset Status can be
monitored using RXBRS and TXBRS. This function is not used with OAM Bundles.
Release Bundle: To Release a TXP Bundle payload data path from Reset, first
select the direction using RXBRE and TXBRE (0 = release; 1 = reset = do not
release). When the Bundle # is written to RXTXBS and Sequence Seed to SNS,
the Bundle is ready with a new Sequence Seed value waiting to be activated. A
Bundle’s Status Registers are not enabled until the Bundle is released from Reset.
RXTXBS
Bundle # to be Reset
BRCR2
RXBRE
RXP Bundle Reset Enable
TXBRE
TXP Bundle Reset Enable
BRSR
RXBRS
RXP Bundle Reset Status
TXBRS
TXP Bundle Reset Status
Bundle Activation Control
BACR
OBS
OAM Bundle Select
Assign Bundle ID (PWID): To Assign a Bundle ID to a Bundle, first program the
Bundle ID using BIDV. Then use OBS = 0 and BS to select the Bundle Number (0
– 255). The BIDV value will be written to that Bundle Number when the WE
transitions from “0 to 1”.
Bundle Activate State: To Activate or De-activate a Bundle ID, first program the
Activate state using ABE. Then use OBS = 0 and BIDV to select the Bundle
Number (0 – 255). The Activate state will be written to that Bundle Number when
WE transitions from “0 to 1”. All Bundles must be released from Reset after a
Power up/Reset before they can be Activated.
WE
Write Enable
RE
Read Enable
BS
Bundle Number
BADR1
ABE
Activate Bundle
BADR2
BIDV
Bundle ID
Bundle Configuration Control
BCCR
WE
Write Enable
Configure Bundle Attributes: To configure the attributes of a Bundle, first
program all of the attributes in B.BCDR1 through B.BCDR5. Then use BS to
specify the Bundle Number (0-255). The new set of attributes will be written to that
Bundle when WE transitions from “0 to 1”. The BCDR1 – BCDR5 settings are
described in Bundle Configuration tables (that follow) according to the application.
RE
Read Enable
BS
Bundle Number
BCDR1-5
Misc Bundle Functions
In the Bundle Configuration tables that follow (for B.BCDR1 through B.BCDR5): “x” = “any valid value”; for the
column titles, “M” = “MPLS”, “U” = “UDP”, “L” = “L2TPv3”, “E” = “MEF”. Values not identified in the Comment
column are invalid. Values included in “[ ]” brackets means “recommended value”, but other values in the comment
column are possible. The “RT” column indicates whether the configuration register is used in the “RXP only”, “TXP
only” or “RXP and TXP” directions.
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參數(shù)描述
DS34S132GN+ 功能描述:通信集成電路 - 若干 32Port TDM-Over-Pack Transport Device RoHS:否 制造商:Maxim Integrated 類(lèi)型:Transport Devices 封裝 / 箱體:TECSBGA-256 數(shù)據(jù)速率:100 Mbps 電源電壓-最大:1.89 V, 3.465 V 電源電壓-最小:1.71 V, 3.135 V 電源電流:50 mA, 225 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝:Tube
DS34S132GNA2+ 功能描述:通信集成電路 - 若干 32Port TDM-Over-Pack Transport Device RoHS:否 制造商:Maxim Integrated 類(lèi)型:Transport Devices 封裝 / 箱體:TECSBGA-256 數(shù)據(jù)速率:100 Mbps 電源電壓-最大:1.89 V, 3.465 V 電源電壓-最小:1.71 V, 3.135 V 電源電流:50 mA, 225 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝:Tube
DS34T101 制造商:MAXIM 制造商全稱(chēng):Maxim Integrated Products 功能描述:Single/Dual/Quad/Octal TDM-over-Packet Chip
DS34T101_08 制造商:MAXIM 制造商全稱(chēng):Maxim Integrated Products 功能描述:Single/Dual/Quad/Octal TDM-over-Packet Chip
DS34T101_09 制造商:MAXIM 制造商全稱(chēng):Maxim Integrated Products 功能描述:Single/Dual/Quad/Octal TDM-over-Packet Chip
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