19-4750; Rev 1; 07/11 38 of 194 the Fragment byte depth (e.g. 24 bytes for T1).
參數(shù)資料
型號: DS34S132GN+
廠商: Maxim Integrated Products
文件頁數(shù): 127/194頁
文件大?。?/td> 0K
描述: IC TDM OVER PACKET 676-BGA
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 40
功能: TDM-over-Packet(TDMoP)
接口: TDMoP
電路數(shù): 1
電源電壓: 1.8V, 3.3V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 676-BGA
供應(yīng)商設(shè)備封裝: 676-PBGA(27x27)
包裝: 管件
其它名稱: 90-34S13+2N0
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁第100頁第101頁第102頁第103頁第104頁第105頁第106頁第107頁第108頁第109頁第110頁第111頁第112頁第113頁第114頁第115頁第116頁第117頁第118頁第119頁第120頁第121頁第122頁第123頁第124頁第125頁第126頁當(dāng)前第127頁第128頁第129頁第130頁第131頁第132頁第133頁第134頁第135頁第136頁第137頁第138頁第139頁第140頁第141頁第142頁第143頁第144頁第145頁第146頁第147頁第148頁第149頁第150頁第151頁第152頁第153頁第154頁第155頁第156頁第157頁第158頁第159頁第160頁第161頁第162頁第163頁第164頁第165頁第166頁第167頁第168頁第169頁第170頁第171頁第172頁第173頁第174頁第175頁第176頁第177頁第178頁第179頁第180頁第181頁第182頁第183頁第184頁第185頁第186頁第187頁第188頁第189頁第190頁第191頁第192頁第193頁第194頁
DS34S132 DATA SHEET
19-4750; Rev 1; 07/11
38 of 194
the Fragment byte depth (e.g. 24 bytes for T1). Pn.PRCR1.BFD and Pn.PTCR1.BFD specify how many Fragments
are used by each Staging Buffer (4 Fragments will store data for a 4 x 125 us = 500 us period).
BPF should be set to the number of bytes exchanged on the TDAT/RDAT interface in a 125 us period (e.g. for T1:
17 hex for “24 bytes”; for E1: 1F hex for “32 bytes”). For applications where TDAT and RDAT are used to support a
slower, non-T1/E1 interface, the BPF can be set to any integer value to represent the TDM Port data rate (data
received in a 125 us period; e.g. BPF = 1 for 64 Kb/s).
The BFD setting enables a compromise between the processing latency and the total number of Bundles supported
by an S132. Smaller BFD settings enable a smaller processing latency (smaller wait period to fill the Staging
Buffer), but with a smaller maximum number of Bundles. To function properly, the BFD value must also be set so
that the data stored in the Staging Buffer cannot exceed the smallest Bundle payload size associated with that TDM
Port (i.e. the number of bytes represented by BPF * BFD must be ≤ the number of bytes represented by
B.BCDR1.PMS for all Bundles assigned to that TDM Port). Table 9-3 describes the BFD settings.
Table 9-3. TDM Port BFD Settings
BFD value Staging Buffer Depth
Staging Buffer Latency
Maximum # of Bundles
0
TDM Port data path disabled
-
1
1 Fragment
125 us
64
2
2 Fragment
250 us
128
3
4 Fragment
500 us
256
For CES applications, the BFD and PMS settings can be directly compared since both are essentially specified in
frames (BFD PMS; for CES applications the number of bytes stored by the Staging Buffer Fragment is equal to
the number of bytes in one CES Frame, or 1 Fragment = 1 Frame). As an example, if PMS = 3 (3 frames per
packet payload), then BFD should be set to 10b or 01b (1 or 2 fragments). For SAT applications the PMS setting is
specified in bytes (instead of frames) and the TXP/RXP Bundle packets are programmed to carry a payload size
that is not related to a frame size (“frames” are not applicable to the SAT/Unstructured application). For SAT
applications the following “BFD to PMS” comparison can be used:
BFD (in Fragments) x BPF (in bytes per Fragment) ≤ PMS (in bytes)
In SAT applications, the S132 supports T1/E1 line rates and slower, non-T1/E1 rates. For all SAT applications, the
Pn.PRCR1.SPL register be programmed to indicate how many bytes are included in each RXP/TXP Bundle
payload. The TDM Port SPL value should be set to the same value as the Bundle PMS.
For SAT (Unstructured), non-T1/E1 applications (e.g. V.35), the TDM Port should use a line rate that is
approximately equal to an integer multiple of 64 Kb/s. This might be referred to as an “Unstructured Nx64” signal. In
this document it is called a “non-T1/E1” signal. Unstructured (SAT) signals usually are asynchronous signals. The
term “Nx64” can also refer to a “Structured Nx64” signal that is synchronized to the public network and can be
carried by a T1/E1 for transporting and switching in the public network (e.g. “Fractional T1/E1” and ISDN signals). A
“Structured Nx64” signal is carried by a CES PW (the S132 only supports “Structured Nx64” with T1/E1 line rate
TDM Ports).
For the best latency performance, each TDM Port BFD should be set to the lowest possible value allowed for the
maximum number of Bundles that will be supported by the S132. With a selected BFD value, all Bundle PMS
values associated with that TDM Port cannot be smaller than BFD. As an example, if it is necessary to support a
Bundle with a PMS = 1 (1 frame per packet or one packet every 125 us) then no more than 64 Bundles can be
supported by the S132 (the standards only require a maximum packet rate of one packet every 1 ms).
9.2.4 Timeslot Assignment Block
For T1/E1 applications, the S132 includes a Timeslot Assignment Block with the ability to monitor outgoing CAS
and control outgoing SW CAS Conditioning, Data Conditioning, and Loopback functions (depicted in Figure 9-13).
相關(guān)PDF資料
PDF描述
DS34T102GN+ IC TDM OVER PACKET 484TEBGA
DS3501U+H IC POT NV 128POS HV 10-USOP
DS3502U+ IC POT DGTL NV 128TAP 10-MSOP
DS3503U+ IC POT DGTL NV 128TAP 10-MSOP
DS3897MX IC TXRX BTL TRAPEZIODAL 20-SOIC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DS34S132GN+ 功能描述:通信集成電路 - 若干 32Port TDM-Over-Pack Transport Device RoHS:否 制造商:Maxim Integrated 類型:Transport Devices 封裝 / 箱體:TECSBGA-256 數(shù)據(jù)速率:100 Mbps 電源電壓-最大:1.89 V, 3.465 V 電源電壓-最小:1.71 V, 3.135 V 電源電流:50 mA, 225 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝:Tube
DS34S132GNA2+ 功能描述:通信集成電路 - 若干 32Port TDM-Over-Pack Transport Device RoHS:否 制造商:Maxim Integrated 類型:Transport Devices 封裝 / 箱體:TECSBGA-256 數(shù)據(jù)速率:100 Mbps 電源電壓-最大:1.89 V, 3.465 V 電源電壓-最小:1.71 V, 3.135 V 電源電流:50 mA, 225 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝:Tube
DS34T101 制造商:MAXIM 制造商全稱:Maxim Integrated Products 功能描述:Single/Dual/Quad/Octal TDM-over-Packet Chip
DS34T101_08 制造商:MAXIM 制造商全稱:Maxim Integrated Products 功能描述:Single/Dual/Quad/Octal TDM-over-Packet Chip
DS34T101_09 制造商:MAXIM 制造商全稱:Maxim Integrated Products 功能描述:Single/Dual/Quad/Octal TDM-over-Packet Chip