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參數(shù)資料
| 型號(hào)： | DS34S132GN+ |
| 廠商： | Maxim Integrated Products |
| 文件頁(yè)數(shù)： | 117/194頁(yè) |
| 文件大小： | 0K |
| 描述： | IC TDM OVER PACKET 676-BGA |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 40 |
| 功能： | TDM-over-Packet（TDMoP） |
| 接口： | TDMoP |
| 電路數(shù)： | 1 |
| 電源電壓： | 1.8V, 3.3V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 676-BGA |
| 供應(yīng)商設(shè)備封裝： | 676-PBGA（27x27） |
| 包裝： | 管件 |
| 其它名稱： | 90-34S13+2N0 |
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DS34S132 DATA SHEET
19-4750; Rev1; 7/11
29 of 194
9.1 Connection Types
The following subsections describe the different connection types in more detail.
9.1.1 SAT/CES Payload Connections
The S132 can support up to 256 SAT/CES Payload Connections spread across 32 TDM Ports. Each SAT/CES
Payload Connection carries constant bit rate data and is programmed as part of a Bundle. In the RXP direction, the
Classifier identifies a packet for a SAT/CES Payload Connection when the received Header and PW-ID match that
of a Bundle and that Bundle is programmed to forward payload data to a SAT/CES Engine. The SAT/CES Payload
Connection is diagramed in Figure 9-3.
Figure 9-3. SAT/CES Payload Connection
S132
RXP Pkt
Classifier
TXP Pkt
Generator
RXP Bundle
Jitter Buffer
RXP
TSA
TXP
TSA
Ethernet
MAC
TDM
Port
TXP Bundle
Buffer
SAT/
CES
Engine
Each Bundle can be configured to support any number of DS0s up to an entire TDM Port line rate. In the RXP
direction the PW Header is stripped off of the packets and the payload is stored in a Jitter Buffer to smooth the
bursty transmission of the PSN. In the TXP direction, when sufficient SAT/CES Payload has been received the
S132 appends a configured TXP Bundle Header to generate a PW packet. A Timeslot Assignment block provides a
DS0 cross-connect function to interconnect the payload of any SAT/CES Bundle to any set of DS0 positions on a
single TDM Port and to allow control and monitoring of Sub-channel CAS Signaling and Data Conditioning.
A Bundle that includes a SAT/CES Payload Connection can also include a PW-Timing Connection and an In-band
VCCV (CPU) Connection (the PW-Timing and CPU Connections are described in the sections that follow).
9.1.2 HDLC Connections
The S132 supports up to 256 HDLC Connections. This connection type can be used to support T1/E1 CCS
Signaling or other HDLC encoded packet streams. Each HDLC Connection is programmed as part of a Bundle. In
the RXP direction, the Classifier identifies a packet for an HDLC Connection when the header and PW-ID of a
received packet matches the Header protocol and BID of a Bundle and that Bundle is programmed to forward data
to an HDLC Engine. The HDLC Connection is diagramed in Figure 9-4.
Figure 9-4. Bundle HDLC Connection
S132
RXP
TSA
TXP
TSA
Ethernet
MAC
TDM
Port
RXP Pkt
Classifier
TXP Pkt
Generator
HDLC
Engine
RXP Bundle
(Jitter) Buffer
TXP Bundle
Buffer
At the TDM Port the HDLC data appears as constant bit rate data because the HDLC packet stream, at the TDM
Port, is supplemented with Idle HDLC Flags (Idle Flags are used during time periods when there are no HDLC
packets). On the Ethernet/PW side the HDLC encoding does not exist. The HDLC data no longer appears as
constant bit rate data since the HDLC Idle Flags are not carried by the HDLC PWs (only non-idle packet data is
carried by an HDLC PW).
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相關(guān)代理商/技術(shù)參數(shù) |
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| DS34S132GN+ | 功能描述:通信集成電路 - 若干 32Port TDM-Over-Pack Transport Device RoHS:否 制造商:Maxim Integrated 類型:Transport Devices 封裝 / 箱體:TECSBGA-256 數(shù)據(jù)速率:100 Mbps 電源電壓-最大:1.89 V, 3.465 V 電源電壓-最小:1.71 V, 3.135 V 電源電流:50 mA, 225 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝:Tube |
| DS34S132GNA2+ | 功能描述:通信集成電路 - 若干 32Port TDM-Over-Pack Transport Device RoHS:否 制造商:Maxim Integrated 類型:Transport Devices 封裝 / 箱體:TECSBGA-256 數(shù)據(jù)速率:100 Mbps 電源電壓-最大:1.89 V, 3.465 V 電源電壓-最小:1.71 V, 3.135 V 電源電流:50 mA, 225 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝:Tube |
| DS34T101 | 制造商:MAXIM 制造商全稱:Maxim Integrated Products 功能描述:Single/Dual/Quad/Octal TDM-over-Packet Chip |
| DS34T101_08 | 制造商:MAXIM 制造商全稱:Maxim Integrated Products 功能描述:Single/Dual/Quad/Octal TDM-over-Packet Chip |
| DS34T101_09 | 制造商:MAXIM 制造商全稱:Maxim Integrated Products 功能描述:Single/Dual/Quad/Octal TDM-over-Packet Chip |
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