參數(shù)資料
型號: W948D6FBHX6G
廠商: WINBOND ELECTRONICS CORP
元件分類: DRAM
英文描述: 8M X 16 DDR DRAM, 5 ns, PBGA60
封裝: 8 X 9 MM, 0.80 MM PITCH, HALOGEN FREE AND LEAD FREE, VFBGA-60
文件頁數(shù): 32/60頁
文件大小: 1147K
代理商: W948D6FBHX6G
W948D6FB / W948D2FB
256Mb Mobile LPDDR
Publication Release Date : May, 24, 2011
- 38 -
Revision A01-003
7.6.10 Interrupting Write to Read
Data for any Write burst may be truncated by a subsequent READ command as shown in the figure below. Note that
the only data-in pairs that are registered prior to the tWTR period are written to the internal array, and any subsequent
data-in must be masked with DM.
BA,Col n
BA,Col b
WRITE
NOP
CK
Command
Address
1) Dl b = Data in to column b. DO n=Data out from column n.
2) An interrupted burst of 4 is shown, 2 data elements are written.
3 subsequent elements of Data In are applied in the programmed order following DI b.
3) tWTR is referenced from the positive clock edge after the last Data In pair.
4)A10 is LOW with the WRITE command (Auto Precharge is disabled)
5) The READ and WRITE commands are to the same device but not necessarily to the same bank.
NOP
READ
= Don't Care
DQS
DQ
DM
tDQSSmax
BA,Col n
tWTR
CL=3
DI b
DO n
NOP
7.6.11 Write to Precharge
Data for any WRITE burst may be followed by a subsequent PRECHARGE command to the same bank (provided
Auto Precharge was not activated). To follow a WRITE without truncating the WRITE burst, tWR should be met as
shown in the figure below.
7.6.12 Non-Interrupting Write to Precharge
BA,Col n
BA,Col b
WRITE
NOP
PRE
CK
Command
Address
1) Dl b = Data in to column b
3 subsequent elements of Data In are applied in the programmed order following DI b.
2) A non-interrupted burst of 4 is shown.
3) tWR is referenced from the positive clock edge after the last Data In pair.
4) A10 is LOW with the WRITE command (Auto Precharge is disabled)
NOP
= Don't Care
DQS
DQ
DM
tDQSSmax
BA a (or all)
tWR
DI b
相關(guān)PDF資料
PDF描述
WF128K32-120HC5 512K X 8 FLASH 5V PROM MODULE, 120 ns, CHIP66
WF128K32-90HM5 512K X 8 FLASH 5V PROM MODULE, 90 ns, CHIP66
WS128K32-35CJM 512K X 8 MULTI DEVICE SRAM MODULE, 35 ns, CQCC68
WS512K32F-100G2Q 2M X 8 MULTI DEVICE SRAM MODULE, 100 ns, QMA68
WMS128K8L-100DJIE 128K X 8 STANDARD SRAM, 100 ns, CDSO36
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W949D2CB 制造商:WINBOND 制造商全稱:Winbond 功能描述:512Mb Mobile LPDDR
W949D2CBJX5E 功能描述:IC LPDDR SDRAM 512MBIT 90VFBGA RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 格式 - 存儲器:閃存 存儲器類型:閃存 - NAND 存儲容量:4G(256M x 16) 速度:- 接口:并聯(lián) 電源電壓:2.7 V ~ 3.6 V 工作溫度:0°C ~ 70°C 封裝/外殼:48-TFSOP(0.724",18.40mm 寬) 供應(yīng)商設(shè)備封裝:48-TSOP I 包裝:Digi-Reel® 其它名稱:557-1461-6
W949D2CBJX5ETR 制造商:Winbond Electronics Corp 功能描述:512M MDDR, X32, 200MHZ
W949D2CBJX5I 制造商:Winbond Electronics Corp 功能描述:DRAM Chip Mobile LPDDR SDRAM 512M-Bit 16Mx32 1.8V 90-Pin VFBGA
W949D2CBJX5I TR 制造商:Winbond Electronics Corp 功能描述:512M MDDR, X32, 200MHZ, INDUST