參數(shù)資料
型號： TSB12LV01APZ
廠商： Texas Instruments, Inc.
英文描述： High-Speed Serial-Bus Link-Layer Controller
中文描述： 高速串行總線鏈路層控制器
文件頁數(shù)： 49/71頁
文件大小： 267K
代理商： TSB12LV01APZ
5–1
5 Electrical Characteristics
5.1
Absolute Maximum Ratings Over Free-Air Temperature Range (Unless
Otherwise Noted)
Supply voltage range, V
CC
Supply voltage range, V
CC
5V
Input voltage range, V
I
(standard TTL/LVCMOS)
Input voltage range, V
I
(5-V standard TTL/LVCMOS)
Output voltage range, (standard TTL/LVCMOS) V
O
Output voltage range, (5-V standard TTL/LVCMOS) V
O
Input clamp current, I
IK
(TTL/LVCMOS) (V
I
< 0 or V
I
> V
CC
) (see Note 1)
Output clamp current, I
OK
(TTL/LVCMOS) (V
O
< 0 or V
O
> V
CC
) (see Note 2)
Continuous total power dissipation
. . . . . . . . . . . . . . . . .
Operating free-air temperature range, T
A
(TSB12LV01A)
–0.5 V to 3.6 V
–0.5 V to 5.5 V
–0.5 V to V
CC
+ 0.5 V
–0.5 V to V
CC
+ 0.5 V
–0.5 V to V
CC
+ 0.5 V
–0.5 V to V
CC
+ 0.5 V
. . . . . . . . . . . .
. . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . .
±
20 mA
±
20 mA
See Maximum Dissipation Rating Table
. . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . .
0
°
C to 70
°
C
–40
°
C to 85
°
C
–65
°
C to 150
°
C
(TSB12LV01AI)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These
are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated
under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for
extended periods may affect device reliability.
NOTES:
1. This applies to external input and bidirectional buffers. For 5-V tolerant terminals, use VI > VCC5V.
2. This applies to external output and bidirectional buffers. For 5-V tolerant terminals, use VO > VCC5V.
MAXIMUM DISSIPATION RATING TABLE
PACKAGE
TA
≤
25
°
C
POWER RATING
DERATING FACTOR
ABOVE TA = 25
°
C
16.9 mW/
°
C
TA = 70
°
C
POWER RATING
TA = 85
°
C
POWER RATING
PZ
1500 mW
737 mW
486 mW
PACKAGE THERMAL CHARACTERISTICS
PARAMETER
TEST
PZ PACKAGE
WN PACKAGE
UNIT
CONDITIONS
MIN
NOM
MAX
MIN
NOM
MAX
R
θ
JA
Junction-to-ambient thermal
impedance
Board mounted,
No air flow
59
52
°
C/W
R
θ
JC
Junction-to-case thermal
impedance
13
8
°
C/W
TJ
Thermal characteristics very depending on die and leadframe pad size as well as mold compound. These values
preresent typical die and pad sizes for the respective packages. The R value decreases as the die or pad sizes
increases. Thermal values represent PWB bands with minimal amounts of metal.
Junction temperature
115
175
°
C
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