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參數(shù)資料
| 型號： | SII3512ECTU128 |
| 元件分類： | 總線控制器 |
| 英文描述： | PCI BUS CONTROLLER, PQFP128 |
| 封裝： | LEAD FREE, TQFP-128 |
| 文件頁數(shù)： | 58/132頁 |
| 文件大?。?/td> | 3011K |
| 代理商： | SII3512ECTU128 |
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SiI3512 PCI to Serial ATA Controller
Data Sheet
Silicon Image, Inc.
DS-0102-D01
2007-2010 Silicon Image, Inc. All rights reserved.
23
CONFIDENTIAL
Board Mounting Guidelines
The following are general recommendations for mounting exposed pad lead-frame devices on the PCB. This should serve
as the starting point in assembly process development and it is recommended that the process should be developed based
on past experience in mounting standard, non-ePad packages.
Stencil Design
For proper ground connection, it is required that the exposed pad on the package be soldered to the landing area on the
PCB. This requires solder paste application not only on the pad pattern for lead attachment but also on the landing area
using the stencil. While for standard (non-ePad) lead-frame based packages the stencil thickness depends on the lead
pitch and package co-planarity only, the package standoff also needs to be considered for the ground enhanced packages
to determine the stencil thickness. For a nominal standoff of 0.1 mm, the stencil thickness of 5 to 8 mils (depending upon
the pitch) should still provide good solder joint between the exposed pad and the landing area. The aperture openings
should be the same as the solder mask opening on the ground land. Because a large stencil opening may result in poor
release, the aperture opening can be subdivided into an array of smaller openings, similar to the ground land pattern
shown in Figure 10. The above guidelines will result in the solder joint area to be about 80 to 90% of the exposed pad
area.
Figure 10. Top View of Recommended Stencil Design
Dimensions in millimeters
Recommended
Stencil Openings
1 x 1 Sq. with 1.2 mm Pitch
Pin 1
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| SK12430PJT | 800 MHz, OTHER CLOCK GENERATOR, PQCC28 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SII3531 | 制造商:SILICONIMAGE 制造商全稱:SILICONIMAGE 功能描述:SteelVine⑩ Host Controller |
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| SII3611 | 制造商:SILICONIMAGE 制造商全稱:SILICONIMAGE 功能描述:SATALink Device Bridge |
| SII3611CT80-1.5 | 制造商:SILICON IMAGE 功能描述:3611CT80-1.5 |
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