參數(shù)資料
型號: SII3512ECTU128
元件分類: 總線控制器
英文描述: PCI BUS CONTROLLER, PQFP128
封裝: LEAD FREE, TQFP-128
文件頁數(shù): 55/132頁
文件大?。?/td> 3011K
代理商: SII3512ECTU128
SiI3512 PCI to Serial ATA Controller
Data Sheet
Silicon Image, Inc.
DS-0102-D01
2007-2010 Silicon Image, Inc. All rights reserved.
21
CONFIDENTIAL
Enhanced Packaging (SiI3512ECTU128)
The SiI3512ECTU128 is packaged in a 128-pin TQFP with an exposed metal pad (5.385x5.385 mm) on the package
designed to improve signal quality by having a low-inductance ground connection. The exposed pad should be soldered
to a landing area on the PCB, as described below. The characterization results show improved signal quality by going
above 25% coverage of the exposed pad area. A poor connection of the exposed pad to the landing area on the PCB may
result in CRC or primitive error if the environments are noisy.
PCB Design Requirements
In order to improve the signal quality, it is required that landing area be incorporated on the PCB within the footprint of
the package corresponding to the exposed metal pad on the package, as shown in Figure 8. Although the size of this
landing area can be larger than the exposed pad on the package, the solderable area, as defined by the solder mask,
should be at least the same as the exposed pad area on the package. A clearance of at least 0.5 mm should be designed on
the PCB between the outer edges of the landing area and the inner edges of pad pattern for the leads to avoid any shorts.
Figure 7. Top View of Enhanced 128-pin TQFP Package
Dimensions in millimeters (inches)
0.6096
(0.024)
5.385
(0.212)
5.385
(0.212)
14.0
16.0
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