參數(shù)資料
型號: SII3512ECTU128
元件分類: 總線控制器
英文描述: PCI BUS CONTROLLER, PQFP128
封裝: LEAD FREE, TQFP-128
文件頁數(shù): 57/132頁
文件大?。?/td> 3011K
代理商: SII3512ECTU128
SiI3512 PCI to Serial ATA Controller
Data Sheet
Silicon Image, Inc.
22
2007-2010 Silicon Image, Inc. All rights reserved.
DS-0102-D01
CONFIDENTIAL
Figure 8. Top View of TQFP Landing Area Design on PCB
Ground vias are required in the metal land to provide a low-impedance connection to ground. An array of vias should be
incorporated in the ground pad at a 1.2-mm pitch grid, as shown in Figure 9. The via diameter should be approximately
0.30 mm (12 mils). It is also desirable to avoid any solder wicking inside the via during the soldering process, which may
result in voids in solder between the exposed pad and the PCB landing area. The ground vias can be ―tented‖ with solder
mask on the top surface of the PCB to avoid solder wicking inside the via during assembly. The solder mask diameter
should be at least 0.1 mm (4 mils) larger than the via diameter.
Figure 9. Ground Pad Via Grid
Dimensions in millimeters
5.385
0.3-mm diameter with 1.2-mm
pitch Ground Via
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