參數(shù)資料
型號: i960 VH
廠商: Intel Corp.
英文描述: Embedded-PCI Processor(嵌入式PCI處理器)
中文描述: 嵌入式PCI處理器(嵌入式處理器的PCI)
文件頁數(shù): 35/64頁
文件大?。?/td> 851K
代理商: I960 VH
80960VH
Preliminary
Datasheet
35
3.2.1.3
Thermal Resistance
The thermal resistance value for the case-to-ambient,
θ
CA
, is used as a measure of the cooling
solution’s thermal performance.
3.2.2
Thermal Analysis
Table 14
lists the case-to-ambient thermal resistances of the 80960VH for different air flow rates
without a heat sink.
To calculate T
A
, the maximum ambient temperature to conform to a particular case temperature:
T
A
= T
C
- P (
θ
CA
)
Compute P by multiplying I
CC
and V
CC
. Values for
θ
JC
and
θ
CA
are given in
Table 14
.
Junction temperature (T
J
) is commonly used in reliability calculations. T
J
can be calculated from
θ
JC
(thermal resistance from junction to case) using the following equation:
T
J
= T
C
+ P (
θ
JC
)
Similarly, when T
A
is known, the corresponding case temperature (T
C
) can be calculated as
follows:
T
C
= T
A
+ P (
θ
CA
)
The
θ
JA
(Junction-to-Ambient) for this package is currently estimated at 26.54° C/Watt with no
airflow.
θ
JA
=
θ
JC
+
θ
CA
Table 14. 324-Lead PBGA Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
Airflow — ft./min (m/sec)
0
(0)
100
(0.50)
200
(1.01)
400
(2.03)
600
(3.04)
800
(4.06)
θ
JC
(Junction-to-Case)
θ
(Case-to-Ambient)
Without Heatsink
1.36
1.36
1.36
1.36
1.36
1.36
25.18
20.30
18.29
16.57
15.55
14.75
NOTE:
1. This table applies to a PBGA device soldered directly onto a board.
θ
JA
θ
JC
θ
CA
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