
80960VH
34
Preliminary Datasheet
3.2
Package Thermal Specifications
The device is specified for operation when T
C
(case temperature) is within the range of 0° C to
95° C. Case temperature may be measured in any environment to determine whether the processor
is within specified operating range. Measure the case temperature at the center of the top surface,
opposite the ballpad.
3.2.1
Thermal Specifications
This section defines the terms used for thermal analysis.
3.2.1.1
Ambient Temperature
Ambient temperature, T
A
, is the temperature of the ambient air surrounding the package. In a
system environment, ambient temperature is the temperature of the air upstream from the package.
3.2.1.2
Case Temperature
To ensure functionality and reliability, the device is specified for proper operation when the case
temperature, T
C
, is within the specified range in
Table 16, Operating Conditions (pg. 36)
.
When measuring case temperature, attention to detail is required to ensure accuracy. If a
thermocouple is used, then calibrate it before taking measurements. Errors may result when the
measured surface temperature is affected by the surrounding ambient air temperature. Such errors
may be due to a poor thermal contact between thermocouple junction and the surface, heat loss by
radiation, or conduction through thermocouple leads.
To minimize measurement errors:
Use a 35 gauge K-type thermocouple or equivalent.
Attach the thermocouple bead or junction to the package top surface at a location
corresponding to the center of the die (). The center of the die gives a more accurate
measurement and less variation as the boundary condition changes.
Attach the thermocouple bead or junction at a 90° angle by an adhesive bond (such as thermal
epoxy or heat-tolerant tape) to the package top surface as shown in .
Figure 5. Thermocouple Attachment
Thermocouple Bead
Thermocouple Wire
Epoxy Fillet