參數(shù)資料
型號(hào): HDMP-1024
英文描述: Low Cost Gigabit Rate Receive Chip Set with TTL I/Os(帶TTL輸入/輸出的低價(jià)格千兆位速率接收芯片)
中文描述: 低成本千兆速率接收芯片組配備TTL的I / O(帶的TTL輸入/輸出的低價(jià)格千兆位速率接收芯片)
文件頁(yè)數(shù): 22/40頁(yè)
文件大?。?/td> 363K
代理商: HDMP-1024
22
Mechanical Dimensions
and Package Information
Both the HDMP-1022 and
HDMP-1024 are implemented in
an industry standard M-Quad 80
package. The package footprint
dimensions conform to JEDEC
Pub 95 metric plastic QFP specifi-
cations and are shown below in
Figure 10. The M-Quad 80
package material is aluminum and
the leads have been formed into a
“Gull-Wing” configuration for
surface mounting.
Forced air cooling is
recommended.
Figure 10. Mechanical Dimensions of HDMP-1022 and HDMP-1024.
M-Quad 80 Package Information
Item
Package Material
Lead Finish Material
Lead Finish Thickness
Lead Coplanarity
Details
Aluminum
85/15 Sn/Pb
300 - 600
μ
inches
0.10 mm maximum
Recommended Handling
Precautions
The MQUAD package has an open
cavity internally; hence ultrasonic
cleaning will damage the device.
DO NOT USE ultrasonic cleaning
processes with this device.
Additional circuitry is built into
the various input and output pins
on this chip to protect them
against low level electrostatic
discharge, however, they are still
ESD sensitive and standard
procedures for static sensitive
devices should be used in
handling and assembly of this
chip.
PIN #1 ID
7 DEG MAX.
23.20 ± 0.25
19.79-0.05
17.20 ± 0.25
+0.15
-0.005
13.79
0.80 BSC
0.35 TYP.
0.15
0.60 MAX.
0.25 MIN.
TOP VIEW
ALL DIMENSIONS ARE IN MILLIMETERS.
+0.10
-0.19
2.70
+0.15
-0.05
0.88
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