參數(shù)資料
型號(hào): KBE00G003M
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: NAND 512Mb*2 + Mobile SDRAM 256Mb*2
中文描述: NAND閃存的512Mb * 2移動(dòng)SDRAM 256Mb的* 2
文件頁數(shù): 50/89頁
文件大?。?/td> 1238K
代理商: KBE00G003M
KBE00G003M-D411
MCP MEMORY
July 2005
50
Revision 0.1
OPERATING AC PARAMETER
(AC operating conditions unless otherwise noted)
NOTES:
1. The minimum number of clock cycles is determined by dividing the minimum time required with clock cycle time and then rounding off to the next
higher integer.
2. Minimum delay is required to complete write.
3. All parts allow every cycle column address change.
4. In case of row precharge interrupt, auto precharge and read burst stop.
Parameter
Symbol
KBE00G003M-D411
Unit
Note
Row active to row active delay
t
RRD
(min)
18
ns
1
RAS to CAS delay
t
RCD
(min)
27
ns
1
Row precharge time
t
RP
(min)
27
ns
1
Row active time
t
RAS
(min)
50
ns
1
t
RAS
(max)
100
us
Row cycle time
t
RC
(min)
77
ns
1
Last data in to row precharge
t
RDL
(min)
15
ns
2
Last data in to Active delay
t
DAL
(min)
tRDL + tRP
-
Last data in to new col. address delay
t
CDL
(min)
1
CLK
2
Last data in to burst stop
t
BDL
(min)
1
CLK
2
Auto refresh cycle time
t
ARFC
(min)
80
ns
Exit self refresh to active command
t
SRFX
(min)
120
ns
Col. address to col. address delay
t
CCD
(min)
1
CLK
3
Number of valid output data
CAS latency=3
2
ea
4
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