參數(shù)資料
型號(hào)： HSP50216KI
廠商： HARRIS SEMICONDUCTOR
元件分類： 無繩電話/電話
英文描述： Four-Channel Programmable Digital DownConverter
中文描述： TELECOM, CELLULAR, BASEBAND CIRCUIT, PBGA196
封裝： BGA-196
文件頁(yè)數(shù)： 53/53頁(yè)
文件大小： 561K
代理商： HSP50216KI
53
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: (321) 724-7000
FAX: (321) 724-7240
TEL: (32) 2.724.2111
FAX: (32) 2.724.22.05
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
ASIA
Intersil (Taiwan) Ltd.
7F-6, No. 101 Fu Hsing North Road
Taipei, Taiwan
Republic of China
TEL: (886) 2 2716 9310
FAX: (886) 2 2715 3029
HSP50216
Plastic Ball Grid Array Packages (BGA)
o
TOP VIEW
D
A1 CORNER
BOTTOM VIEW
P
N
L
M
J
K
G
H
F
E
8
13
14
121110 9
CORNER
7 6 5
3
4
2
C
D
A
B
1
SIDE VIEW
SEATING PLANE
C
A
A1
A2
bbb
C
aaa
A1 CORNER I.D.
E
A
B
E1
D1
b
S
ALL ROWS AND COLUMNS
S
M
A B
C
C
0.15
0.006
0.08
0.003
M
A1
A1
CORNER I.D.
e
A
A
C
V196.12x12
196 BALL PLASTIC BALL GRID ARRAY PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.059
-
1.50
-
A1
0.012
0.016
0.31
0.41
-
A2
0.038
0.044
0.96
1.11
-
b
0.016
0.020
0.41
0.51
7
D/E
0.468
0.476
11.90
12.10
-
D1/E1
0.405
0.413
10.30
10.50
-
N
196
196
-
e
0.032 BSC
0.80 BSC
-
MD/ME
14 x 14
14 x 14
3
bbb
0.004
0.10
-
aaa
0.005
0.12
-
Rev. 1 10/99
NOTES:
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. DimensioningandtolerancingconformtoASMEY14.5M-1994.
3. “MD” and “ME” are the maximum ball matrix size for the “D”
and “E” dimensions, respectively.
4. “N” is the maximum number of balls for the specific array size.
5. Primary datum C and seating plane are defined by the spher-
ical crowns of the contact balls.
6. Dimension “A” includes standoff height “A1”, package body
thickness and lid or cap height “A2”.
7. Dimension “b” is measured at the maximum ball diameter,
parallel to the primary datum C.
8. Pin “A1” is marked on the top and bottom sides adjacent to A1.
9. “S” is measured with respect to datum’s A and B and defines
the position of the solder balls nearest to package center-
lines. When there is an even number of balls in the outer row
the value is “S” = e/2.
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