參數(shù)資料
型號(hào): AD6623ASZ
廠商: Analog Devices Inc
文件頁數(shù): 42/48頁
文件大?。?/td> 0K
描述: IC TSP 4CHAN 104MSPS 128MQFP
標(biāo)準(zhǔn)包裝: 1
應(yīng)用: 傳輸信息處理器
接口: 串行
封裝/外殼: 128-BFQFP
供應(yīng)商設(shè)備封裝: 128-MQFP(14x20)
包裝: 托盤
安裝類型: 表面貼裝
REV. A
AD6623
–47–
OUTLINE DIMENSIONS
128-Lead Plastic Quad Flatpack [MQFP]
(S-128A)
Dimensions shown in millimeters
TOP VIEW
(PINS DOWN)
1
38
39
65
64
102
128
103
0.27
0.17
0.50
BSC
1.03
0.88
0.73
SEATING
PLANE
3.40
MAX
COPLANARITY
0.10 MAX
0.50
0.25
2.90
2.70
2.50
17.45
17.20
16.95
14.20
14.00
13.80
20.20
20.00
19.80
23.45
23.20
22.95
196-Lead Chip Scale Ball Grid Array [CSPBGA]
(BC-196)
Dimensions shown in millimeters
DETAIL A
1.70
MAX
SEATING PLANE
0.30 MIN
DETAIL A
0.70
0.60
0.50
BALL
DIAMETER
0.20
COPLANARITY
13.00 BSC
SQ
A
B
C
D
E
F
G
H
J
K
L
M
N
P
14 13 12 11 10 9 8 7 6 5 4 3 2 1
1.00 BSC
BALL PITCH
15.00 BSC SQ
TOP VIEW
BOTTOM VIEW
A1 CORNER
COMPLIANT TO JEDEC STANDARDS MO-192AAE-1
NOTES
1. ACTUAL POSITION OF THE BALL GRID IS WITHIN 0.20 OF ITS IDEAL
POSITION RELATIVE TO THE PACKAGE EDGES.
2. ACTUAL POSITION OF EACH BALL IS WITHIN 0.10 OF ITS IDEAL POSITION
RELATIVE TO THE BALL GRID.
3. CENTER DIMENSIONS ARE NOMINAL.
BALL A1
INDICATOR
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