參數(shù)資料
型號: AD6623ASZ
廠商: Analog Devices Inc
文件頁數(shù): 41/48頁
文件大?。?/td> 0K
描述: IC TSP 4CHAN 104MSPS 128MQFP
標準包裝: 1
應(yīng)用: 傳輸信息處理器
接口: 串行
封裝/外殼: 128-BFQFP
供應(yīng)商設(shè)備封裝: 128-MQFP(14x20)
包裝: 托盤
安裝類型: 表面貼裝
REV. A
AD6623
–46–
MHz
–10
dBc
10
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–8
–6
–4
–2
0
2
4
6
8
10
CIC RESPONSE
COMPOSITE
RESPONSE
DESIRED
RESPONSE
Figure 45. Composite Response to First CIC5 Null
THERMAL MANAGEMENT
The power dissipation of the AD6623 is primarily determined by
three factors: the clock rate, the number of channels active, and
the distribution of interpolation rates. The faster the clock rate
the more power dissipated by the CMOS structures of the AD6623
and the more channels active the higher the overall power of the
chip. Low interpolation rates in the CIC stages (CIC5, CIC2)
results in higher power dissipation. All these factors should be
analyzed as each application has different thermal requirements.
The AD6623 128-Lead MQFP is specially designed to provide
excellent thermal performance. To achieve the best performance
the power and ground leads should be connected directly to
planes on the PC board. This provides the best thermal transfer
from the AD6623 to the PC board.
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