參數(shù)資料
型號(hào): XCF128XFTG64C
廠商: Xilinx Inc
文件頁(yè)數(shù): 54/88頁(yè)
文件大?。?/td> 0K
描述: IC PROM SRL 128M GATE 64-FTBGA
標(biāo)準(zhǔn)包裝: 1
可編程類(lèi)型: 系統(tǒng)內(nèi)可編程
存儲(chǔ)容量: 128Mb
電源電壓: 1.7 V ~ 2 V
工作溫度: -40°C ~ 85°C
封裝/外殼: 64-TBGA
供應(yīng)商設(shè)備封裝: 64-TFBGA
包裝: 托盤(pán)
產(chǎn)品目錄頁(yè)面: 601 (CN2011-ZH PDF)
其它名稱(chēng): 122-1578
Platform Flash XL High-Density Configuration and Storage Device
DS617 (v3.0.1) January 07, 2010
Product Specification
58
R
Ordering Information
Valid Ordering Combinations
Table 33: Power-Up Timing Characteristics
Symbol
Parameter
VDDQ =
2.3V to 2.7V
VDDQ =
3.0V to 3.6V
Unit
Min
Max
Min
Max
TRWL(1)
READY_WAIT Low driven from the device
60
60
μs
TRWLRWH
READY_WAIT pulse driven from the system
50
50
ns
TRWRT(2)
READY_WAIT rise time
–1–1
μs
TPHRWZ
Time from RP High to when device releases READY_WAIT to high-
impedance state
–200
μs
TPLRWL
Reset Low to READY_WAIT Low
50
50
ns
TRST
Time required to trigger a device reset when VDD drops below the
maximum VDDPD threshold
515
5
15
ms
TVDDPOR
VDD ramp rate
0.2
50
0.2
50
ms
TVDQHPOR
VDDQ ramp rate
0.2
50
0.2
50
ms
TVHRWZ
Time from VDD/VDDQ POR thresholds to when device releases
READY_WAIT to high-impedance state
515
5
15
ms
Notes:
1.
Depends on the VDD/VDDQ operating conditions.
2.
READY_WAIT requires an external pull-up resistor to VDDQ sufficiently strong to ensure a clean Low-to-High transition within less than
TRWRT when the READY_WAIT pin is released to a high-impedance state.
X-Ref Target - Figure 35
Notes:
1.
Figure 35: Ordering Information
Example: XCF128X FTG64 C
Device Type
Package Type
Operating Range
FT64 = 64-ball, Fine-Pitch Thin Ball Grid Array
FTG64 = 64-ball, Fine-Pitch Thin Ball Grid Array, Pb-free
DS617_11_050808
C = Industrial (TA = –40°C to +85°C)
Table 34: Valid Ordering Combinations
XCF128XFTG64C
XCF128XFT64C
相關(guān)PDF資料
PDF描述
XCF32PFS48C IC PROM SRL 1.8V 32M 48CSBGA
XCR3256XL-7CS280C IC CPLD 256MCELL 3.3V HP 280CSP
XCS10-3VQG100C IC FPGA 5V C-TEMP 100-VQFP
XCV600E-8HQ240C IC FPGA 1.8V C-TEMP 240-HQFP
XCV812E-8FG900C IC FPGA 1.8V C-TEMP 900-FBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XCF128XFTG64CES 制造商:Xilinx 功能描述:
XCF12-L4Z1 制造商:SAIA - BURGESS ELECTRONICS INC. 功能描述:Catalogue / XCF12-L4Z1
XCF12-S1 制造商:SAIA - BURGESS ELECTRONICS INC. 功能描述:Catalogue / XCF12-S1
XCF13-S1 制造商:SAIA - BURGESS ELECTRONICS INC. 功能描述:Catalogue / XCF13-S1
XCF16P 制造商:XILINX 制造商全稱(chēng):XILINX 功能描述:Platform Flash In-System Programmable Configuration PROMs