
Technical Data
MC68HC11E Family
—
Rev. 4
28
Pin Descriptions
MOTOROLA
Pin Descriptions
2.2 Introduction
M68HC11 E-series MCUs are available packaged in:
52-pin plastic-leaded chip carrier (PLCC)
52-pin windowed ceramic leaded chip carrier (CLCC)
52-pin plastic thin quad flat pack, 10 mm x 10 mm (TQFP)
64-pin quad flat pack (QFP)
48-pin plastic dual in-line package (DIP), MC68HC811E2 only
56-pin plastic shrink dual in-line package, .070-inch lead spacing
(SDIP)
Most pins on these MCUs serve two or more functions, as described in
the following paragraphs. Refer to
Figure 2-1
,
Figure 2-2
,
Figure 2-3
,
Figure 2-4
, and
Figure 2-5
which show the M68HC11 E-series pin
assignments for the PLCC/CLCC, QFP, TQFP, SDIP, and DIP
packages.
Figure 2-1. Pin Assignments for 52-Pin PLCC and CLCC
PE4/AN4
PE0/AN0
PB0/ADDR8
PB1/ADDR9
PB2/ADDR10
PB3/ADDR11
PB4/ADDR12
PB5/ADDR13
PB6/ADDR14
PB7/ADDR15
PA0/IC3
E
S
E
S
M
M
S
V
S
V
R
V
R
P
P
XTAL
PC0/ADDR0/DATA0
PC1/ADDR1/DATA1
PC2/ADDR2/DATA2
PC3/ADDR3/DATA3
PC4/ADDR4/DATA4
PC5/ADDR5/DATA5
PC6/ADDR6/DATA6
PC7/ADDR7/DATA7
RESET
*XIRQ/V
PPE
P
P
P
P
P
V
D
P
P
P
P
P
M68HC11 E SERIES
8
9
10
11
12
13
14
15
16
17
18
19
44
43
42
41
40
39
38
37
36
35
34
2
2
2
2
2
2
2
2
2
3
3
7
6
5
4
3
1
2
5
5
5
4
IRQ
PD0/RxD
P
3
P
3
P
4
P
4
PE1/AN1
45
PE5/AN5
46
20
* V
PPE
applies only to devices with EPROM/OTPROM.