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| 型號(hào)： | OR4E14 |
| 廠商： | Lineage Power |
| 英文描述： | Field-Programmable Gate Arrays(現(xiàn)場(chǎng)可編程門陣列) |
| 中文描述： | 現(xiàn)場(chǎng)可編程門陣列（現(xiàn)場(chǎng)可編程門陣列） |
| 文件頁(yè)數(shù)： | 39/132頁(yè) |
| 文件大?。?/td> | 2667K |
| 代理商： | OR4E14 |
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Lucent Technologies Inc.
39
Preliminary Data Sheet
August 2000
ORCA Series 4 FPGAs
Special Function Blocks
(continued)
Temperature Sensing
The built-in temperature-sensing diodes allow junction
temperature to be measured during device operation. A
physical pin (PTEMP) is dedicated for monitoring
device junction temperature. PTEMP works by forcing a
10 mA current in the forward direction, and then mea-
suring the resulting voltage. The voltage decreases
with increasing temperature at approximately
–1.69 mV/°C. A typical device with a 85 °C device tem-
perature will measure approximately 630 mV.
Table 21. Dedicated Temperature Sensing
Boundary-Scan
The IEEE standards 1149.1 and 1149.2 (IEEE Stan-
dard test access port and boundary-scan architecture)
are implemented in the ORCA series of FPGAs. It
allows users to efficiently test the interconnection
between integrated circuits on a PCB as well as test the
integrated circuit itself. The IEEE1149 standard is a
well-defined protocol that ensures interoperability
among boundary-scan (BSCAN) equipped devices
from different vendors.
Series 4 FPGAs are also compliant to IEEE standard
1532/D1. This standard for boundary-scan based in-
system configuration of programmable devices pro-
vides a standardized programming access and method-
ology for FPGAs. A device, or set of devices,
implementing this standard may be programmed, read
back, erased verified, singly or concurrently, with a
standard set of resources.
The IEEE 1149 standards define a test access port
(TAP) that consists of a four-pin interface with an
optional reset pin for boundary-scan testing of inte-
grated circuits in a system. The ORCA Series FPGA
provides four interface pins: test data in (TDI), test
mode select (TMS), test clock (TCK), and test data out
(TDO). The
PRGM
pin used to reconfigure the device
also resets the boundary-scan logic.
The user test host serially loads test commands and
test data into the FPGA through these pins to drive out-
puts and examine inputs. In the configuration shown in
Figure 26, where boundary-scan is used to test ICs,
test data is transmitted serially into TDI of the first
BSCAN device (U1), through TDO/TDI connections
between BSCAN devices (U2 and U3), and out TDO of
the last BSCAN device (U4). In this configuration, the
TMS and TCK signals are routed to all boundary-scan
ICs in parallel so that all boundary-scan components
operate in the same state. In other configurations, mul-
tiple scan paths are used instead of a single ring. When
multiple scan paths are used, each ring is indepen-
dently controlled by its own TMS and TCK signals.
Figure 26 provides a system interface for components
used in the boundary-scan testing of PCBs. The three
major components shown are the test host, boundary-
scan support circuit, and the devices under test
(DUTs). The DUTs shown here are ORCA Series
FPGAs with dedicated boundary-scan circuitry. The
test host is normally one of the following: automatic test
equipment (ATE), a workstation, a PC, or a micropro-
cessor.
5-5972(F)
Key: BSC = boundary-scan cell, BDC = bidirectional data cell, and
DCC = data control cell.
Figure 25. Printed-Circuit Board with Boundary-
Scan Circuitry
Dedicated Temperature Sensing Diode Pin Per
Package
BA352
BC432
AB3
AH31
BM680
AK4
INSTRUCTION
REGISTER
TDO
BYPASS
REGISTER
TCK TMS TDI
SCAN
OUT
SCAN
IN
SCAN
OUT
SCAN
IN
SCAN
IN
SCAN
OUT
BSC
BDC
DCC
SCAN
OUT
SCAN
IN
TAPC
p_in
p_in
p_out
p_in
p_ts
p_out
p_ts
p_in
p_out
p_ts
p_out
p_ts
PL[ij]
PT[ij]
PR[ij]
PB[ij]
BDC
DCC
PLC
ARRAY
BDC
DCC
BDC
DCC
BSC
BSC
BSC
SEE ENLARGED VIEW BELOW.
TMS TDI
TCK
TDO
TMS TDI
TCK
TDO
TMS TDI
TCK
TDO
TMS TDI
TCK
TDO
U1
U2
U3
U4
TDI
TCK
TDO
TMS
net a
net b
net c
S
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