參數(shù)資料
型號(hào): DAC1617D1G0HN
廠商: NXP Semiconductors N.V.
元件分類: 外設(shè)及接口
英文描述: Dual 16-bit DAC: up to 1 Gsps; x2, x4 and x8 interpolating
封裝: DAC1617D1G0HN/C1<SOT813-3 (HVQFN72)|<<http://www.nxp.com/packages/SOT813-3.html<1<Always Pb-free,;DAC1617D1G0HN/C1<SOT813-3 (HVQFN72)|<<http://www.nxp.com/packages/SOT813
文件頁數(shù): 60/66頁
文件大?。?/td> 519K
代理商: DAC1617D1G0HN
DAC1617D1G0
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Objective data sheet
Rev. 1.1 — 30 September 2011
60 of 66
NXP Semiconductors
DAC1617D1G0
Dual 16-bit DAC: up to 1 Gsps; x2, x4 and x8 interpolating
12. Abbreviations
Table 65.
Acronym
BW
BWA
CDI
CDMA
CML
CMOS
DAC
EDGE
FIR
GSM
IF
IMD3
LMDS
LO
LVDS
NCO
NMOS
PLL
SFDR
SPI
WCDMA
WLL
Abbreviations
Description
BandWidth
Broadband Wireless Access
Clock Domain Interface
Code Division Multiple Access
Current Mode Logic
Complementary Metal Oxide Semiconductor
Digital-to-Analog Converter
Enhanced Data rates for GSM Evolution
Finite Impulse Response
Global System for Mobile communications
Intermediate Frequency
Third Order InterModulation
Local Multipoint Distribution Service
Local Oscillator
Low-Voltage Differential Signaling
Numerically Controlled Oscillator
Negative Metal-Oxide Semiconductor
Phase-Locked Loop
Spurious-Free Dynamic Range
Serial Peripheral Interface
Wide band Code Division Multiple Access
Wireless Local Loop
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