參數(shù)資料
型號(hào)： celeron processor
廠商： Intel Corp.
英文描述： 32 bit Celeron Processor Mobile Module(32 位帶移動(dòng)模塊處理器)
中文描述： 32位賽揚(yáng)處理器的移動(dòng)模塊（32位帶移動(dòng)模塊處理器）
文件頁(yè)數(shù)： 7/64頁(yè)
文件大?。?/td> 799K
代理商： CELERON PROCESSOR
Celeron
Processor Mobile Module MMC-2
at 650 MHz, 600 MHz, 550 MHz, 500 MHz, and 450 MHz
243357-004
Datasheet
1
1.0
Introduction
This document provides the technical information for integrating the Intel Celeron processor
mobile module connector 2 (MMC-2) into the latest notebook systems for today’s notebook
market.
Building around this design gives the system manufacturer these advantages:
Avoids complexities associated with designing high-speed processor core logic boards
Provides an upgrade path from previous Intel mobile modules using a standard interface
1.1
References
Refer to the following documents for additional information on the Celeron processor mobile
module.
Mobile Celeron Processor in BGA2 and Micro-PGA2 Packages at 650 MHz, 600 MHz, 500
MHz, 450 MHz, and 400A MHz datasheet (Order Number 245417)
Intel
440BX AGPSet: 82443BX Host Bridge/Controller Datasheet (Order Number: 290633-
001)
82371AB PCI-to-ISA/IDE Xcelerator (PIIX4) (Order Number: 290562-001)
Intel
82371MB (PIIX4E/M) Specification Update*
CK97 Clock Synthesizer/Driver Specification (OR-1089)
Intel
Mobile Module MMC-2 Simulation and Validation Kit Rev. 4.0 (OR- 2333)
Intel
Pentium
III
Processor Mobile Module System Electronics 100-MHz Layout Guidelines
Rev. 1.0 (OR-1780)
Mobile Pentium
III
Processor/440BX AGPset Recommended Design and Debug Practices
(RDDP-A) 100 MHz Rev. 2.0 (SC-2760)
66/100 MHz PC SDRAM Unbuffered SO-DIMM Specification Rev 1.0*
Intel
Mobile Module Design Guide (AP-590)
Pentium
II Processor Mobile Module MMC-2 Insertion & Extraction User Manual Rev 1.0*
Mobile Pentium
II Processor Mobile Module 400-Pin BGA Connector Assembly
Development Guide Rev. 1.0*
Focused Discussion on Intel
Mobile Modules Design for Mfg. & Best Methods for MHPG
Customers Rev. 1.0 (OR-1385)
EMI design Guide (order number ORMD6-0859)
Intel
Mobile Module Newsletters*
Intel
Mobile Module Thermal Diode Temperature Sensor Application Note*
Intel
MMC-2 Standoff/Receptacle Height Spreadsheet*
AGP Interface Specification Version 2.0
* Available now, contact your Intel Field Representative
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