參數(shù)資料
型號： celeron processor
廠商： Intel Corp.
英文描述： 32 bit Celeron Processor Mobile Module(32 位帶移動模塊處理器)
中文描述： 32位賽揚(yáng)處理器的移動模塊（32位帶移動模塊處理器）
文件頁數(shù)： 41/64頁
文件大?。?/td> 799K
代理商： CELERON PROCESSOR
Celeron
Processor Mobile Module MMC-2
at 650 MHz, 600 MHz, 550 MHz, 500 MHz, and 450 MHz
243357-004
Datasheet
35
5.3.3
Power Planes: Bulk Capacitance Requirements
The placement of sufficient bulk capacitance on the system electronics board is critical to the
operation of the mobile module and to ensure that the system design can accommodate future high
frequency modules. Intel has provided the maximum possible bulk capacitance on the mobile
module. However, in order to achieve proper filtering and in-rush current protection, it is
imperative that additional filtering be provided on the system electronics board.
Table 25
details
the bulk capacitance requirements for the system electronics.
Note:
Observe the voltage rating requirement for the capacitors on each respective voltage rail.
Table 25. Bulk Capacitance Requirements
NOTES:
1. Placement of above capacitance requirements should be located near the connector.
2. V_CLK filtering should be located next to the system clock synthesizer.
3. The Ripple current specification depends on the V_DC input for the module. See
Figure 7
below.
4. If Tantalum* Capacitors are used, a 50% voltage derating practice must be observed. For example, a 5.0-V
rail requires a 10.0-V rated capacitor.
5. In order to reduce ESR, Intel recommends the use of multiple bulk capacitors rather than a single large
capacitor.
6. Intel strongly recommends that system manufacturers pay close attention to capacitor design considerations.
Specifically, the "Capacitance vs. Temperature De-rating Curve," "Capacitance vs. Applied DC Voltage De-
rating Curve," and the "Capacitance vs. Frequency De-rating Curve." Some capacitor dielectrics are
particularly susceptible to these conditions, for example Y5V ceramic capacitors.
7. Specifications labeled N/A are not available.
Power
Plane
Bulk Capacitance Requirements
High Frequency Capacitance
Requirements
Notes
Total
Capacitance
ESR
Max
RMS Ripple
Current
V_DC
100.0
μ
F
20.0 m
3.0A~ 5.0A
0.1
μ
F, 0.01
μ
F
Notes 1,3,4,5,6
V_5
100.0
μ
F
100.0 m
1.0A
0.1
μ
F, 0.01
μ
F
Notes 1,4,5,6
V_3
470.0
μ
F
100.0 m
1.0A
0.1
μ
F, 0.01
μ
F
Notes 1,4,5,6
V_3S
100.0
μ
F
100.0 m
N/A
0.1
μ
F 0.01
μ
F
Notes 1,4,5,6
VCC_AGP
22.0
μ
F
100.0 m
1.0A
0.1
μ
F, 0.01
μ
F
Notes 1,4,5,6
V_CPUPU
2.2
μ
F
N/A
N/A
8200.0 pF
Notes 1,5,6,7
V_CLK
10.0
μ
F
N/A
N/A
8200.0 pF
Notes 1,2,5,6,7
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